United States Patent
US Patent 5323971: Pulverizing, separating, and size regulating…
US 5323971 · granted 1994-06-28
Abstract
The materials to be treated, for instance, molded resin articles with resin films coated thereon are treated by relatively simple means to separate and remove the resin film coatings from the surfaces thereof, and are further treated to recover them as a raw-form of resin material or a resin material regulated such that its particle diameter lies within a given particle diameter range, or the materials to be treated, for instance, powder materials are pulverized and granulated. A molded resin article is crushed to small pieces, to which compression impacts based on fine vibrations are in turn applied for squeezing, and resin film coatings separated off the small pieces are removed. The thus treated small pieces are further re-pulverized, and frictional crushing impacts are applied to the thus pulverized pieces as well for polishing and size-regulation. Alternatively, directional fine vibrations are applied to one of the inner and outer compression impact surfaces of inner and outer compression impact members that are located in opposition to each other with a given gap between them to pulverize and squeeze the material to be treated that is fed between the compression impact surfaces, thereby separating surface thin films therefrom for granulation.
| Patent Number | 5323971 |
|---|---|
| Title | Pulverizing, separating, and size regulating molded resin articles |
| Filed | 1992-10-22 |
| Granted | 1994-06-28 |
| Inventor(s) | Itakura; Yuzp, Nishibori; Sadao |
| Assignee | Ein Co., Ltd. |
| Number of Claims | 69 |
Abstract
The materials to be treated, for instance, molded resin articles with resin films coated thereon are treated by relatively simple means to separate and remove the resin film coatings from the surfaces thereof, and are further treated to recover them as a raw-form of resin material or a resin material regulated such that its particle diameter lies within a given particle diameter range, or the materials to be treated, for instance, powder materials are pulverized and granulated. A molded resin article is crushed to small pieces, to which compression impacts based on fine vibrations are in turn applied for squeezing, and resin film coatings separated off the small pieces are removed. The thus treated small pieces are further re-pulverized, and frictional crushing impacts are applied to the thus pulverized pieces as well for polishing and size-regulation. Alternatively, directional fine vibrations are applied to one of the inner and outer compression impact surfaces of inner and outer compression impact members that are located in opposition to each other with a given gap between them to pulverize and squeeze the material to be treated that is fed between the compression impact surfaces, thereby separating surface thin films therefrom for granulation.
Claim 1
A pulverizing and separating process for separating and removing a resin film from a molded resin article having a resin film onits surface, thereby recovering a raw form of resin material, comprising the steps of: first, crushing a molded resin article into a plurality of small pieces; next, squeezing said plurality of small pieces by applying thereto, by means of spaced apart compression impact-applying surfaces, compression impacts based on fine vibrations; supplying a separation-accelerating liquid between said spaced apart compression impact-applying surfaces.
Claims
69 totalA pulverizing and separating process for separating and removing a resin film from a molded resin article having a resin film onits surface, thereby recovering a raw form of resin material, comprising the steps of: first, crushing a molded resin article into a plurality of small pieces; next, squeezing said plurality of small pieces by applying thereto, by means of spaced apart compression impact-applying surfaces, compression impacts based on fine vibrations; supplying a separation-accelerating liquid between said spaced apart compression impact-applying surfaces.