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Method of manufacturing a sealing cap for an integrated circuit carrying substrate |
| T105403 |
Method of manufacturing a sealing cap for an integrated circuit carrying substrate
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| Inventor: |
Hultmark |
| Date Issued: |
May 7, 1985 |
| Application: |
06/636,877 |
| Filed: |
August 2, 1984 |
| Inventors: |
Hultmark; Eric B. (Wappingers Falls, NY)
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| U.S. Class: |
257/697; 257/719; 257/724; 257/E23.181; 264/293; 428/45 |
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| Abstract: |
A cap for sealing a substrate having integrated circuit chips thereon is manufactured by ultrasonically machining a pattern of channels in the top surface of a plate, the pattern of channels defining a plurality of pedestals at locations corresponding to integrated circuit chip locations on the substrate. The pedestal tops are then ultrasonically machined so that each top lies a predetermined distance from the top surface of the plate.Ceramic caps manufactured according to the present invention may be mass produced with precise dimensional tolerances. |
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