| |
 |
Copolyester hot-melt adhesives |
| T100504 |
Copolyester hot-melt adhesives
|
|
| Patent Drawings: | |
| Inventor: |
Sublett |
| Date Issued: |
April 7, 1981 |
| Application: |
06/136,143 |
| Filed: |
March 31, 1980 |
| Inventors: |
Sublett; Bobby J. (Kingsport, TN)
|
| Assignee: |
|
| Primary Examiner: |
|
| Assistant Examiner: |
|
| Attorney Or Agent: |
|
| U.S. Class: |
528/302 |
| Field Of Search: |
|
| International Class: |
|
| U.S Patent Documents: |
|
| Foreign Patent Documents: |
|
| Other References: |
|
|
| Abstract: |
Copolyesters useful as low melting fusible interlining adhesives derived from (1) terephthalic acid, (2) succinic or glutaric acid, (3) ethylene glycol and (4) 1,6-hexanediol or derivatives of these components. |
| Claim: |
|
| Description: |
|
|
|
|
