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LED-array package
D703624 LED-array package
Patent Drawings:

Inventor: Andrews, et al.
Date Issued: April 29, 2014
Application:
Filed:
Inventors:
Assignee:
Primary Examiner: Sikder; Selina
Assistant Examiner:
Attorney Or Agent: Jenkins, Wilson, Taylor & Hunt, P.A.
U.S. Class: D13/180
Field Of Search: ;D13/180; ;D26/1; ;257/79; ;257/80; ;257/81; ;257/88; ;257/89; ;257/95; ;257/98; ;257/99; ;257/100; ;257/E33.058; ;313/483; ;313/498; ;313/500; ;362/555; ;362/800
International Class: 1303
U.S Patent Documents:
Foreign Patent Documents: 002114934-0001; 002114934-0002
Other References: US. Appl. No. 13/424,699 dated Mar. 20, 2012. cited by applicant.
Japanese Office Action for Application No. 2012-024518 dated Feb. 26, 2013. cited by applicant.
Chinese Office Action for Application No. 201230476421.3 dated Jul. 18, 2013. cited by applicant.
Japanese Invitation for Amendment for Application No. 2012-024518 dated Jul. 30, 2013. cited by applicant.
Japanese Decision of Registration for Design Application No. 2012-024518 dated Sep. 24, 2013. cited by applicant.
Restriction Requirement for U.S. Appl. No. 29/433,842 dated Oct. 2, 2013. cited by applicant.









Abstract:
Claim: CLAIM The ornamental design for an LED-array package, as shown and described.
Description: FIG. 1 is a perspective view of the LED-array package, a lens and light-emitting diodes (LEDs) being shown in phantom lines;

FIG. 2 is a front view of the LED-array package of FIG. 1;

FIG. 3 is a rear view of the LED-array package of FIG. 1;

FIG. 4 is a right-side elevation of the LED-array package of FIG. 1, the left-side elevation view being a mirror image thereof;

FIG. 5 is a top plan view of the LED-array package of FIG. 1;

FIG. 6 is a bottom plan view of the LED-array package of FIG. 1;

FIG. 7 is a perspective view of a submount portion of the LED-array package of FIG. 1;

FIG. 8 is a front view of the submount portion of the LED-array package of FIG. 1;

FIG. 9 is a rear view of the submount portion of the LED-array package of FIG. 1;

FIG. 10 is a right-side elevation of the submount portion of the LED-array package of FIG. 1, the left-side elevation view being a mirror image thereof; and,

FIG. 11 is a top plan view of the submount portion of the LED-array package of FIG. 1.

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