||Light emitting diode
||Chen, et al.
||October 11, 2011
||January 20, 2011
||Chen; Yi-Wei (Tucheng, TW)
Chen; Po-Yu (Tucheng, TW)
||Everlight Electronics Co., Ltd. (Tucheng, Taipei County, TW)|
|Attorney Or Agent:
||Thomas, Kayden, Horstemeyer & Risley, LLP
|Field Of Search:
||D13/180; 257/79; 257/80; 257/81; 257/88; 257/89; 257/95; 257/98; 257/99; 257/100; 257/E33.058; 313/483; 313/498; 313/500; 362/555; 362/800
|U.S Patent Documents:
|Foreign Patent Documents:
||199056466; U3066206; D1066553; P2004319598; P2007287967; D1325977; D1330405; D1343584; P200916153; P200960113; D113256; D124807; D125767
||English translation of abstract of JP 199056466. cited by other.
English translation of JP D1325977. cited by other.
English translation of JP D1343584. cited by other.
English translation of abstract of JP 200960113A. cited by other.
English translation of abstract of JP 2007287967A. cited by other.
English translation of JP D1066553. cited by other.
English translation of JP D1330405. cited by other.
English translation of abstract of JP 200916153A. cited by other.
English translation of abstract of JP 2004319598A. cited by other.
English translation of abstract of JP U3066206. cited by other.
||CLAIM The ornamental design for a light emitting diode, as shown and described.
||FIG. 1 is a perspective view of a light emitting diode showing the claimed design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear side elevational view thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image of FIG. 4;
FIG. 5 is a bottom plan view thereof; a top plan view being a mirror image of FIG. 5; and,
FIG. 6 is a cross-sectional view along Line 6-6 of FIG. 2.
The window cover of the design is made of light transmissible material. The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.
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