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Housing of a light emitting diode package
D616386 Housing of a light emitting diode package
Patent Drawings:

Inventor: Sheng, et al.
Date Issued: May 25, 2010
Application: D/341,474
Filed: August 6, 2009
Inventors: Sheng; Chung-Han (Taipei, TW)
Chen; Yi-Wen (Taipei, TW)
Assignee: Everlight Electronics Co., Ltd. (Taipei, TW)
Primary Examiner: Sikder; Selina
Assistant Examiner:
Attorney Or Agent: Jianq Chyun IP Office
U.S. Class: D13/180
Field Of Search: D13/180; D26/2; 257/79; 257/80; 257/81; 257/88; 257/89; 257/95; 257/98; 257/99; 257/100; 313/483; 313/498; 313/500; 362/555; 362/800
International Class: 1303
U.S Patent Documents:
Foreign Patent Documents:
Other References:









Abstract:
Claim: CLAIM The ornamental design for a housing of a light emitting diode package, as shown and described.
Description: FIG. 1 is a perspective view of a housing of a light emitting diode package showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof wherein the broken line showing portion of the diode package is for illustrative purpose only and forms no part of the claimed design;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.

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