Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Housing of a light emitting diode package
D616386 Housing of a light emitting diode package
Patent Drawings:

Inventor: Sheng, et al.
Date Issued: May 25, 2010
Application: D/341,474
Filed: August 6, 2009
Inventors: Sheng; Chung-Han (Taipei, TW)
Chen; Yi-Wen (Taipei, TW)
Assignee: Everlight Electronics Co., Ltd. (Taipei, TW)
Primary Examiner: Sikder; Selina
Assistant Examiner:
Attorney Or Agent: Jianq Chyun IP Office
U.S. Class: D13/180
Field Of Search: D13/180; D26/2; 257/79; 257/80; 257/81; 257/88; 257/89; 257/95; 257/98; 257/99; 257/100; 313/483; 313/498; 313/500; 362/555; 362/800
International Class: 1303
U.S Patent Documents:
Foreign Patent Documents:
Other References:









Abstract:
Claim: CLAIM The ornamental design for a housing of a light emitting diode package, as shown and described.
Description: FIG. 1 is a perspective view of a housing of a light emitting diode package showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof wherein the broken line showing portion of the diode package is for illustrative purpose only and forms no part of the claimed design;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.

* * * * *
 
 
  Recently Added Patents
Mobile communication terminal provided with handsfree function and controlling method thereof
Ejection station
Method and system for video parameter analysis and transmission
Methods and systems for optimizing data accesses
Large carrying case
Dynamically updating privacy settings in a social network
Battery grid
  Randomly Featured Patents
Adjustable slot goating die
Pneumatic cylinder
Program counter (PC) trace
Process
Selective wave solder system
Blends of .alpha.-olefin/vinylidene aromatic monomer or hindered aliphatic vinylidene interpolymers with polyolefins
IC card reading/writing apparatus and method for allowing use of multiple vendors
III-V semiconductor structures and methods for forming the same
Drumhead tightening device, support device for drum including the drumhead tightening device, and drum
Control for variable reluctance motors