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Logic module
D603349 Logic module

Patent Drawings:
Inventor: Liu
Date Issued: November 3, 2009
Application: D/301,542
Filed: March 6, 2008
Inventors: Liu; Ai Cheng (Nanjing, CN)
Assignee: Siemens Aktiengesellschaft (Munich, DE)
Primary Examiner: Bui; Daniel D
Assistant Examiner: Johannes; Thomas J
Attorney Or Agent:
U.S. Class: D13/162.1
Field Of Search: D13/158; D13/159; D13/160; D13/162; D13/162.1; D13/163; D13/164; D13/177; D13/178; D13/184; D13/199; D10/106; 439/660; 439/568; 361/686; 361/752; 361/600; 361/601; 361/627; 361/641; 361/690; 361/678; 361/605; 307/149; 307/125; 307/113; 232/4R; 232/1D; 220/324; 220/3.8; 109/173; 206/1.5
International Class: 1303
U.S Patent Documents:
Foreign Patent Documents:
Other References:

Abstract:
Claim: CLAIM The ornamental design for a logic module, as shown and described.
Description: The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a top view of the logic module; and,

FIG. 2 is a side view of the logic module.

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