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Electrolytic plating anode |
| D583779 |
Electrolytic plating anode
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| Patent Drawings: | |
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| Inventor: |
Kuriyama, et al. |
| Date Issued: |
December 30, 2008 |
| Application: |
D/262,881 |
| Filed: |
July 13, 2006 |
| Inventors: |
Kuriyama; Fumio (Tokyo, JP)
Kimura; Masaaki (Tokyo, JP)
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| Assignee: |
Ebara Corporation (Tokyo, JP) |
| Primary Examiner: |
Sikder; Selina |
| Assistant Examiner: |
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| Attorney Or Agent: |
Wenderoth, Lind & Ponack, L.L.P. |
| U.S. Class: |
D13/182 |
| Field Of Search: |
D13/182; D26/1; D26/24; D26/72; D26/74; D26/89; 204/280; 204/286.1; 204/297.01; 204/297.1; 205/98; 205/528; 206/454; 206/711; 361/523; 361/528; 361/529; 257/678 |
| International Class: |
1303 |
| U.S Patent Documents: |
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| Foreign Patent Documents: |
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| Other References: |
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| Abstract: |
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| Claim: |
CLAIM The ornamental design for an electrolytic plating anode, as shown and described. |
| Description: |
The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.
FIG. 1 is a front elevation view of an electrolytic plating anode;
FIG. 2 is a rear view of the electrolytic plating anode shown in FIG. 1;
FIG. 3 is a top plan view of the electrolytic plating anode shown in FIG. 1, wherein the broken lines form no part of the claimed design;
FIG. 4 is a bottom plan view of the electrolytic plating anode shown in FIG. 1;
FIG. 5 is a right side view of the electrolytic plating anode shown in FIG. 1; and,
FIG. 6 is a left side view of the electrolytic plating anode shown in FIG. 1.
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