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Electrolytic plating anode
D583779 Electrolytic plating anode
Patent Drawings:

Inventor: Kuriyama, et al.
Date Issued: December 30, 2008
Application: D/262,881
Filed: July 13, 2006
Inventors: Kuriyama; Fumio (Tokyo, JP)
Kimura; Masaaki (Tokyo, JP)
Assignee: Ebara Corporation (Tokyo, JP)
Primary Examiner: Sikder; Selina
Assistant Examiner:
Attorney Or Agent: Wenderoth, Lind & Ponack, L.L.P.
U.S. Class: D13/182
Field Of Search: D13/182; D26/1; D26/24; D26/72; D26/74; D26/89; 204/280; 204/286.1; 204/297.01; 204/297.1; 205/98; 205/528; 206/454; 206/711; 361/523; 361/528; 361/529; 257/678
International Class: 1303
U.S Patent Documents:
Foreign Patent Documents:
Other References:









Abstract:
Claim: CLAIM The ornamental design for an electrolytic plating anode, as shown and described.
Description: The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.

FIG. 1 is a front elevation view of an electrolytic plating anode;

FIG. 2 is a rear view of the electrolytic plating anode shown in FIG. 1;

FIG. 3 is a top plan view of the electrolytic plating anode shown in FIG. 1, wherein the broken lines form no part of the claimed design;

FIG. 4 is a bottom plan view of the electrolytic plating anode shown in FIG. 1;

FIG. 5 is a right side view of the electrolytic plating anode shown in FIG. 1; and,

FIG. 6 is a left side view of the electrolytic plating anode shown in FIG. 1.

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