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Semiconductor wafer delivery apparatus |
| D571740 |
Semiconductor wafer delivery apparatus
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| Patent Drawings: | |
| Inventor: |
Hosaka |
| Date Issued: |
June 24, 2008 |
| Application: |
D/242,546 |
| Filed: |
November 14, 2005 |
| Inventors: |
Hosaka; Hiroki (Nirasaki, JP)
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| Assignee: |
Tokyo Electron Limited (Tokyo, JP) |
| Primary Examiner: |
Sikder; Selina |
| Assistant Examiner: |
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| Attorney Or Agent: |
Oblon, Spivak, McClelland, Maier & Neustadt, P.C. |
| U.S. Class: |
D13/182 |
| Field Of Search: |
D13/182; 134/110; 396/611; 414/331.15; 414/411; 414/416.03; 700/213 |
| International Class: |
1303 |
| U.S Patent Documents: |
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| Foreign Patent Documents: |
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| Other References: |
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| Abstract: |
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| Claim: |
CLAIM The ornamental design for a semiconductor wafer delivery apparatus, as shown and described. |
| Description: |
FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a cross-sectional view taken along line 7--7 in FIG. 1;
FIG. 8 is a top and right front perspective view thereof; and,
FIG. 9 is a top and right rear perspective view thereof.
The broken line showing and the indicia shown in the Figures are shown for illustrative purposes only and form no part of the claimed design.
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