| D568836 |
Groove formed around a semiconductor device on a circuit board
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| Patent Drawings: | |
| Inventor: |
Ohsawa, et al. |
| Date Issued: |
May 13, 2008 |
| Application: |
D/240,252 |
| Filed: |
October 11, 2005 |
| Inventors: |
Ohsawa; Tetsuya (Osaka, JP)
Tani; Emiko (Osaka, JP)
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| Assignee: |
Nitto Denko Corporation (Osaka, JP) |
| Primary Examiner: |
Sikder; Selina |
| Assistant Examiner: |
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| Attorney Or Agent: |
Osha Liang LLP |
| U.S. Class: |
D13/182 |
| Field Of Search: |
D13/182; 174/250; 174/251; 174/253; 174/254; 174/255; 174/256; 174/265; 174/260; 174/261; 361/760; 361/748; 361/720; 336/200 |
| International Class: |
1303 |
| U.S Patent Documents: |
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| Foreign Patent Documents: |
11-8275 |
| Other References: |
Offica Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages). cited by other.
English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page). cited by other.
English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages). cited by other. |
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| Abstract: |
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| Claim: |
CLAIM The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described. |
| Description: |
FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;
FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,
FIG. 3 is a sectional view taken along line 3--3 in FIG. 2.
The broken lines represent unclaimed subject matter.
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