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Grounded electrode for a plasma processing apparatus
D556704 Grounded electrode for a plasma processing apparatus
Patent Drawings:Drawing: D556704-2    Drawing: D556704-3    Drawing: D556704-4    Drawing: D556704-5    
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(4 images)

Inventor: Nakamura, et al.
Date Issued: December 4, 2007
Application: D/236,982
Filed: August 25, 2005
Inventors: Nakamura; Tsutomu (Hikari, JP)
Tauchi; Susumu (Shunan, JP)
Makino; Akitaka (Hikari, JP)
Assignee: Hitachi High-Technologies Corporation (Tokyo, JP)
Primary Examiner: Sikder; Selina
Assistant Examiner: Johannes; Thomas J
Attorney Or Agent: Antonelli, Terry, Stout & Kraus, LLP.
U.S. Class: D13/182
Field Of Search: D13/182; D13/158; D13/159; D13/160; D13/161; D13/162; D13/163; D13/164; D13/165; D13/166; D13/167; D13/168; D13/169; D13/170; D13/171; D13/172; D13/173; D13/174; D13/175; D13/176; D13/177; D13/184; 204/286; 204/297; 205/118; 205/123; 200/1R; 200/5R; 200/52R; 200/315; 200/310; 200/6A; 200/302.1; 200/308; 200/314; 200/317; 200/11R; 200/16B
International Class: 1303
U.S Patent Documents: D404370; D404372; D427570; 6495007; 6663762; 6749728; D494551; D494552; 6843894; 6908540; 7025862; 7087144; 7138039; 2003/0066484
Foreign Patent Documents:
Other References:









Abstract:
Claim: CLAIM The ornamental design for grounded electrode for a plasma processing apparatus, as shown.
Description: FIG. 1 is a front, top and right side perspective view of grounded electrode for a plasma processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan elevational view thereof.

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