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High density interconnection device |
| D494544 |
High density interconnection device
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| Patent Drawings: | |
| Inventor: |
Dulai, et al. |
| Date Issued: |
August 17, 2004 |
| Application: |
D/152,841 |
| Filed: |
December 28, 2001 |
| Inventors: |
Chen; Yen-Ming (Markham, CA)
Daniels; Steven D. (Thornhill, CA)
Drolet; Jean-Francois (Toronto, CA)
Dulai; Harjinder (Unionville, CA)
Laurin; Edward J. (Etobicoke, CA)
Szeto; Colin (North York, CA)
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| Assignee: |
ATI Technologies Inc. (Ontario, CA) |
| Primary Examiner: |
Hyder; Philip S. |
| Assistant Examiner: |
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| Attorney Or Agent: |
Vedder, Price, Kaufman & Kammholz, P.C. |
| U.S. Class: |
D13/133 |
| Field Of Search: |
D13/133; D13/147; D13/146; 439/578; 439/579; 439/660; 439/610; 439/638; 439/639 |
| International Class: |
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| U.S Patent Documents: |
D363269; D390534; D417432; D424017; D425483; D426192; D449579; D456010 |
| Foreign Patent Documents: |
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| Other References: |
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| Abstract: |
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| Claim: |
The ornamental design of a high density interconnection device, as shown and described. |
| Description: |
FIG. 1 is a rear perspective view illustrating a high density interconnection device in accordance with one embodiment of the invention.
FIG. 2 is a front perspective view of the high density interconnection device of FIG. 1.
FIG. 3 is a front elevation view of the high density interconnection device of FIG. 1.
FIG. 4 is a rear elevation view of the high density interconnection device of FIG. 1.
FIG. 5 is a first side elevation view of the high density interconnection device of FIG. 1.
FIG. 6 is a second side elevation view of the high density interconnection device of FIG. 1.
FIG. 7 is a top plan view of the high density interconnection device of FIG. 1.
FIG. 8 is a bottom plan view of the high density interconnection device of FIG. 1.
FIG. 9 is a rear perspective view illustrating a high density interconnection device in accordance with another embodiment of the invention.
FIG. 10 is a front perspective view of the high density interconnection device of FIG. 9.
FIG. 11 is a front elevation view of the high density interconnection device of FIG. 9.
FIG. 12. is a rear elevation view of the high density interconnection device of FIG. 9.
FIG. 13 is a first side elevation of the high density interconnection device of FIG. 9.
FIG. 14 is a second side elevation view of the high density interconnection device of FIG. 9.
FIG. 15 is a top plan view of the high density interconnection device of FIG. 9; and,
FIG. 16 is a bottom plan view of the high density interconnection device of FIG. 9.
The broken line portions of the disclosure are for illustrative purposes only and form no part of the claimed design.
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