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Packaged semiconductor device |
| D489338 |
Packaged semiconductor device
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| Patent Drawings: | |
| Inventor: |
Seddon, et al. |
| Date Issued: |
May 4, 2004 |
| Application: |
D/187,122 |
| Filed: |
July 28, 2003 |
| Inventors: |
Carney; Francis (Gilbert, AZ)
Kime; Kent L. (Phoenix, AZ)
Seddon; Michael (Gilbert, AZ)
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| Assignee: |
Semiconductor Components Industries, L.L.C. (Phoenix, AZ) |
| Primary Examiner: |
Hyder; Philip S. |
| Assistant Examiner: |
Sikder; Selina |
| Attorney Or Agent: |
Stipanuk; James J. |
| U.S. Class: |
D13/182 |
| Field Of Search: |
D13/182; 174/52.1; 174/52.2; 257/666; 257/670; 257/678; 257/684; 257/690; 257/719; 257/776; 257/782; 257/796; 361/760; 361/771; 361/774; 361/792; 361/798; 361/820 |
| International Class: |
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| U.S Patent Documents: |
5434357; 5844307; 5866942; D416236; 6238953; D466873; D472528; 6555899; D476962 |
| Foreign Patent Documents: |
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| Other References: |
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| Abstract: |
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| Claim: |
We claim the ornamental design for a packaged semiconductor device, as shown and described. |
| Description: |
FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;
FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;
FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;
FIG. 4 is a top view of the packaged semiconductor device;
FIG. 5 is a bottom view of the packaged semiconductor device;
FIG. 6 is an elevational view from the left side of the packaged semiconductor device;
FIG. 7 is an elevational view from the right side of the packaged semiconductor device;
FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,
FIG. 9 is an elevational view from the front side of the packaged semiconductor device.
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