| D466873 |
Semiconductor chip package
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| Patent Drawings: | |
| Inventor: |
Kasem, et al. |
| Date Issued: |
December 10, 2002 |
| Application: |
D/151,024 |
| Filed: |
October 31, 2001 |
| Inventors: |
Kasem; Yehja Mohammed (Santa Clara, CA)
Kuo; Frank (Kaoshiung, TW)
Tjhia; Eddy (Sunnyvale, CA)
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| Assignee: |
Siliconix Incorporated (Santa Clara, CA) |
| Primary Examiner: |
Shooman; Ted |
| Assistant Examiner: |
Sikder; Selina |
| Attorney Or Agent: |
Skjerven Morrill LLP |
| U.S. Class: |
D13/182 |
| Field Of Search: |
D13/182; D14/114; 174/52.1; 174/52.2; 174/52.4; 174/52.5; 174/16.3; 206/10; 206/719; 257/254; 257/678; 257/659; 257/668; 257/667; 257/670; 257/676; 257/679; 257/686; 257/688; 257/690; 257/691; 257/692; 257/696; 257/703; 257/778; 361/679; 361/728; 361/742; 361/752; 361/802; 361/818 |
| International Class: |
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| U.S Patent Documents: |
D345731; 5434357; 5596231; 5635670; D396847; 5798570; 5844307; 5959846; 6040625; D444132 |
| Foreign Patent Documents: |
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| Other References: |
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| Abstract: |
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| Claim: |
The ornamental design for a semiconductor chip package, as shown and described. |
| Description: |
FIG. 1 is a perspective view from the left side and above the semiconductor chip package;
FIG. 2 is a perspective view from the left side and below the semiconductor chip package;
FIG. 3 is an elevational view from the left side of the semiconductor chip package;
FIG. 4 is an elevational view from the right side of the semiconductor chip package;
FIG. 5 is an elevational view from the back side of the semiconductor chip package;
FIG. 6 is an elevational view from the front side of the semiconductor chip package;
FIG. 7 is a top view of the semiconductor chip package; and,
FIG. 8 is a bottom view of the semiconductor chip package.
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