Resources Contact Us Home
Place mat
D423271 Place mat
Patent Drawings:Drawing: D423271-2    Drawing: D423271-3    Drawing: D423271-4    Drawing: D423271-5    
« 1 »

(4 images)

Inventor: Brock
Date Issued: April 25, 2000
Application: D/081,945
Filed: January 12, 1998
Inventors: Brock; Deanne M. (Dallas, TX)
Primary Examiner: Morris; Sandra L.
Assistant Examiner: Weingart; Monica A.
Attorney Or Agent: Griggs; Dennis T.
U.S. Class: D6/610; D6/613; D6/616
Field Of Search: D6/610; D6/612; D6/613; D6/616; D6/511; 150/154; 150/158; 150/901; D20/42; 40/597
International Class:
U.S Patent Documents: D173154; D264790; D273070; 5064701; 5430965
Foreign Patent Documents:
Other References:

Claim: The ornamental design for a place mat, as shown and described.
Description: FIG. 1 is a perspective view of a place mat showing my new design;

FIG. 2 is a side elevational view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

* * * * *
  Recently Added Patents
Detection system and method for mobile device application
System for non-destructive image processing
Segmenting video based on timestamps in comments
Sensor chip, sensor cartridge, and analysis apparatus
Methods and apparatuses for anti-shading correction with extended color correlated temperature dependency
Geo-coding images
Functional component compensation reconfiguration system and method
  Randomly Featured Patents
Methods for improving seeds
Fusing device heated by induced current for instantly controlling power
Electrical connector assembly
Device for attaching a stator vane to a turbomachine annular casing, turbojet engine incorporating the device and method for mounting the vane
Air filter for a motorcycle
Drum brake shoe
Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
Fan for use on tables and floors
Fowler-Nordheim block alterable EEPROM memory cell
Packings for gas-liquid contact apparatus