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Tape mounted heatsink package for electronic parts
D405425 Tape mounted heatsink package for electronic parts
Patent Drawings:Drawing: D405425-2    Drawing: D405425-3    Drawing: D405425-4    Drawing: D405425-5    
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(4 images)

Inventor: Hikita
Date Issued: February 9, 1999
Application: D/077,280
Filed: October 1, 1997
Inventors: Hikita; Fumihiko (Kawagoe, JP)
Assignee: Kyoshin Kogyo Co., Ltd. (Tokyo, JP)
Primary Examiner: Vinson; Brian N.
Assistant Examiner:
Attorney Or Agent:
U.S. Class: D13/179
Field Of Search: D13/179; 174/15.1; 174/16.3; 165/82.3; 165/185
International Class:
U.S Patent Documents: D301334; D361986; 4872505
Foreign Patent Documents:
Other References:









Abstract:
Claim: The ornamental design for a tape mounted heatsink package for electronic parts, as shown and described.
Description: FIG. 1 is a top plan view of a tape mounted heatsink package for electronic parts showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof, the right side elevational view being mirror image;

FIG. 6 is a sectional view thereof, taken along line 6--6 in FIG. 2; and,

FIG. 7 is a top, front, and left side perspective view thereof, showing a pair of the heatsinks detached from the tape strip and mounted on an electronic circuit board assembly shown in broken-lines to indicate that it is not intended to form part of the claimed design.

The claimed design is shown broken-away in the views to indicate indeterminate length, it being understood that the heat sink elements are continuous throughout the entire length of the packaging.

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