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Temporary package for semiconductor dice
D401567 Temporary package for semiconductor dice
Patent Drawings:Drawing: D401567-2    Drawing: D401567-3    
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(2 images)

Inventor: Farnworth, et al.
Date Issued: November 24, 1998
Application: D/070,005
Filed: April 25, 1997
Inventors: Akram; Salman (Boise, ID)
Farnworth; Warren M. (Nampa, ID)
Hembree; David R. (Boise, ID)
Wood; Alan G. (Boise, ID)
Assignee: Micron Technology, Inc. (Boise, ID)
Primary Examiner: Vinson; Brian N.
Assistant Examiner:
Attorney Or Agent: Gratton; Stephen A.
U.S. Class: D13/182
Field Of Search: D13/182; 324/755; 324/765; 437/209
International Class:
U.S Patent Documents: D394844; 5173451; 5302891; 5408190; 5440240; 5451165; 5495179; 5517125; 5519332; 5530376; 5541525; 5543725; 5581195; 5742169
Foreign Patent Documents:
Other References: Van Zant, Peter, Microchip Fabrication--A Practical Guide To Semiconductor Processing, Second Edition, 1990, pg. 493..

Claim: The ornamental design for a temporary package for testing semiconductor dice, as shown and described.
Description: FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

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