| D356067 |
Heat dissipating device for a semiconductor package
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| Patent Drawings: | |
| Inventor: |
Itoh |
| Date Issued: |
March 7, 1995 |
| Application: |
07/933,532 |
| Filed: |
August 21, 1992 |
| Inventors: |
Itoh; Akira (Osaka, JP)
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| Assignee: |
Itoh Research & Development Laboratory Co., Ltd. (Osaka, JP) |
| Primary Examiner: |
Burke; Wallace R. |
| Assistant Examiner: |
Sincavage; Joel |
| Attorney Or Agent: |
Fasse; W. G.Fasse; W. F. |
| U.S. Class: |
D13/179 |
| Field Of Search: |
D13/179; D13/182; 437/902; 165/80.2; 165/80.3; 165/104.33; 257/713; 257/720; 361/383; 361/386; 174/52.1; 174/15.2; 174/16.3 |
| International Class: |
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| U.S Patent Documents: |
D276719; 3241605; 3406753; 3572428; 3589046; 3884293; 4292647; 4644385; 4716494; 5087888; 5155579 |
| Foreign Patent Documents: |
0054597 |
| Other References: |
Air-cooled module on p. 1007 of IBM Technical Disclosure Bulletin vol. 20, No. 3 Aug. 1977..
Heat removal module on p. 2249 of IBM Technical Disclosure Bulletin vol. 22 No. 6 Nov. 1979.. |
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| Abstract: |
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| Claim: |
The ornamental design for a heat dissipating device for a semiconductor package, as shown and described. |
| Description: |
FIG. 1 is a front view of an embodiment of the heat dissipating device for a semiconductor package;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a perspective view thereof;
FIG. 7 is a sectional view taken along line 7--7 in FIG. 5 with an attached semiconductor package shown in broken lines only since the semiconductor package does not form any part of the claimed design;
FIG. 8 shows the same side view as FIG. 5 with an attached semiconductor package shown in broken lines only since the semiconductor package does not form any part of the claimed design; and,
FIG. 9 is a top view in the direction of the arrow IX seen from a position perpendicular to the top surface of the heat dissipating device for a semiconductor package.
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