Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Support clip for modular wall construction
D323105 Support clip for modular wall construction
Patent Drawings:Drawing: D323105-2    
« 1 »

(1 images)

Inventor: Paul
Date Issued: January 14, 1992
Application: 07/395,469
Filed: August 18, 1989
Inventors: Paul; Harold J. (Pensacola, FL)
Assignee:
Primary Examiner: Ansher; Bernard
Assistant Examiner: Barkai; R.
Attorney Or Agent: Bode; George A.
U.S. Class: D8/382
Field Of Search: D8/382; D8/387; D8/388; D8/389; D8/394; D8/395; 52/489; 52/509; 52/582; 52/735; 52/764; 52/361; 52/363; 52/DIG.6; 411/457; 411/461; 403/286; 403/403; 403/405.1; 403/205
International Class:
U.S Patent Documents: 529993; 1373036; 1377424; 1668469; 2282624; 3020602; 4558838; 4567706; 4641474
Foreign Patent Documents:
Other References:









Abstract:
Claim: The ornamental design for a support clip for modular wall construction, as shown and described.
Description: FIG. 1 is a front elevational view of a support clip for modular wall construction showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear elevational view thereof; and

FIG. 7 is a top perspective view thereof.

* * * * *
 
 
  Recently Added Patents
Sonic fast-sync system and method for bluetooth
Motor assembly
Information retrieval system, information retrieval method, and information retrieval program
Monitoring and correcting upstream packet loss
Image processing apparatus and image processing method
Electronic device and recording medium
Process for shaping polymeric articles
  Randomly Featured Patents
Recording tape cartridge
Mobile browsing booster system
Electrical connector
Preventative maintenance and diagonstic system
Footwear upper
Levelling device for a material handling member
Plant regulatory sequences for selective control of gene expression
Front air knife top vacuum corrugation feeder
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
Nitrogen containing heteromatics with ortho-substituted P1s as factor Xa inhabitors