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Package for electronic parts or the like
D323061 Package for electronic parts or the like
Patent Drawings:Drawing: D323061-2    Drawing: D323061-3    Drawing: D323061-4    Drawing: D323061-5    Drawing: D323061-6    Drawing: D323061-7    
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(6 images)

Inventor: Takahashi, et al.
Date Issued: January 14, 1992
Application: 07/423,104
Filed: October 18, 1989
Inventors: Kudo; Koji (Tokyo, JP)
Takahashi; Kuniaki (Tokyo, JP)
Takahashi; Tetsuo (Tokyo, JP)
Assignee: TDK Corporation (Tokyo, JP)
Primary Examiner: Ansher; Bernard
Assistant Examiner: Deshmukh; Prabhakar
Attorney Or Agent: Helfgott & Karas
U.S. Class: D14/474; D6/632
Field Of Search: D3/35; D3/30.1; D9/341; D9/428; 221/197; 221/287; 206/533; 206/538; 206/539; 206/328; 206/334; 206/313; D14/120; D14/121; D14/122; D14/123
International Class:
U.S Patent Documents: D273805; D283464; 3332575; 3831808; 4261468; 4399914; 4542495; 4785969; 4811998
Foreign Patent Documents:
Other References:

Claim: The ornamental design for a package for electronic parts or the like, as shown and described.
Description: FIG. 1 is a front perspective view of a package for electronic parts or the like showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front elevation thereof;

FIG. 4 is a rear elevation thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a left side elevation thereof; and

FIG. 8 is a right side elevation thereof.

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