Resources Contact Us Home
Extruded moulding
D299868 Extruded moulding
Patent Drawings:Drawing: D299868-2    
« 1 »

(1 images)

Inventor: Fortier
Date Issued: February 14, 1989
Application: 06/857,455
Filed: April 23, 1986
Inventors: Fortier; Guy (Nord, ST-St-Hilaire, Quebec, CA)
Primary Examiner: Word; A. Hugo
Assistant Examiner:
Attorney Or Agent:
U.S. Class: D25/119
Field Of Search: D25/119; D25/121; D25/123; D25/125
International Class:
U.S Patent Documents: D220566; D251505; D290404
Foreign Patent Documents:
Other References:

Claim: The ornamental design for an extruded moulding, as shown.
Description: FIG. 1 is a perspective view of an extruded moulding showing my new design;

FIG. 2 is an end view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a side view thereof; and

FIG. 5 is a rear view thereof.

* * * * *
  Recently Added Patents
Method and system for automatically hiding irrelevant parts of hierarchical structures in computer user interfaces
Portable gaming device and gaming system combining both physical and virtual play elements
Materials for organic electroluminescent devices containing substituted 10-benzo[c]phenanthrenes
High-density 3-dimensional structure
2,4-disubstituted pyrimidines useful as kinase inhibitors
Pyridazine compounds for controlling invertebrate pests
Use of LPA for encouraging pregnancy, and fertility agent
  Randomly Featured Patents
Methods and systems for improving the operation of transmissions for motor vehicles
Polymeric products containing modified carbon products and methods of making and using the same
Receptor infection assay
Magnetic memory cell and magnetic random access memory using the same
Solid state image pick-up device for imaging an object placed thereon
TPU laminated fabric product and method for forming the product
Spark ignition engine having combustion chamber provided with vent valve
Method and apparatus for forming a centered bore for the femoral stem of hip prosthesis
Side bar lock decoder
Integrated circuit with substantially perpendicular wire bonds