Resources Contact Us Home
Packaging cup or the like
D274224 Packaging cup or the like
Patent Drawings:Drawing: D274224-2    
« 1 »

(1 images)

Inventor: Weaver, et al.
Date Issued: June 12, 1984
Application: 06/311,125
Filed: October 14, 1981
Inventors: Marco; Leslie S. (Bloomingdale, IL)
Weaver; William N. (Northbrook, IL)
Assignee: Illinois Tool Works Inc. (Chicago, IL)
Primary Examiner: Spangler; Robert C.
Assistant Examiner:
Attorney Or Agent: Buckman; Thomas W.
U.S. Class: D9/424; D9/556
Field Of Search: D9/349; D9/350; D9/351; D9/352; D9/353; D9/354; D9/355; D9/390; D9/391; D9/392; D9/393; D9/394; D9/395; D9/396; D9/397; D9/398; D9/399; D9/414; D9/405; D9/403; D9/424; 215/1R; 215/1C
International Class:
U.S Patent Documents: D119303; D188297; D210352; D242599
Foreign Patent Documents:
Other References:

Claim: The ornamental design for a packaging cup or the like, as shown.
Description: FIG. 1 is a side elevational view of a packaging cup or the like showing our new design;

FIG. 2 is a top plan view; and

FIG. 3 is a bottom plan view thereof.

* * * * *
  Recently Added Patents
Front cover of an electronic device
Information processing apparatus, information processing method, and program
Process of preparing functionalized polymers via enzymatic catalysis
Load balancing in shortest-path-bridging networks
Phase locking loop
Methods to fabricate a photoactive substrate suitable for microfabrication
Methods and systems for flicker correction
  Randomly Featured Patents
Aqueous silicone resin coating composition and solid substrate coated therewith
Reconfigurable pneumatic control for split/splitless injection
Method of making a container closure
Room temperature CO sensor and method of making same
Deep trench capacitor for SOI CMOS devices for soft error immunity
Radioactive balloon for dilation catheter system and process for preparation thereof
Method for producing an encapsulation for a SAW component operating with surface acoustic waves
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits
Method of manufacturing a resistor having a low temperature coefficient
Curable thermosetting cyanate ester composition