| D266068 |
Heat releasing plate for mounting semiconductor components
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| Patent Drawings: | |
| Inventor: |
Asanuma |
| Date Issued: |
September 7, 1982 |
| Application: |
06/154,967 |
| Filed: |
May 30, 1980 |
| Inventors: |
Asanuma; Yoshihiko (Tochigi, JP)
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| Assignee: |
Showa Aluminum Kabushiki Kaisha (Osaka, JP) |
| Primary Examiner: |
Lucas; Susan J. |
| Assistant Examiner: |
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| Attorney Or Agent: |
Armstrong, Nikaido, Marmelstein & Kubovcik |
| U.S. Class: |
D13/179 |
| Field Of Search: |
D13/23; 165/8R; 165/8A; 165/8B; 165/8D; 357/81; 174/16HS |
| International Class: |
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| U.S Patent Documents: |
2949283; 3163207; 3180404; 3187812 |
| Foreign Patent Documents: |
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| Other References: |
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| Abstract: |
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| Claim: |
The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described. |
| Description: |
FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof; and
FIG. 6 is a sectional view taken on line 6--6 of FIG. 2.
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