Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Thermal interface material with carbon nanotubes
7253442 Thermal interface material with carbon nanotubes
Patent Drawings:Drawing: 7253442-2    
« 1 »

(1 images)

Inventor: Huang, et al.
Date Issued: August 7, 2007
Application: 11/024,513
Filed: December 29, 2004
Inventors: Huang; Hua (Beijing, CN)
Liu; Chang-Hong (Beijing, CN)
Fan; Shou-Shan (Beijing, CN)
Assignee: Tsing Hua University (Beijing, CN)
Primary Examiner: Pert; Evan
Assistant Examiner: Tran; Tan
Attorney Or Agent: Knapp; Jeffrey T.
U.S. Class: 257/77; 977/712; 977/735; 977/742; 977/743; 977/842; 977/848; 977/855; 977/856
Field Of Search: 524/495; 524/871; 524/875; 257/77; 165/185; 361/704
International Class: H01L 31/0312
U.S Patent Documents: 6350488; 6407922; 2003/0111333; 2004/0097635; 2005/0061496; 2006/0073332
Foreign Patent Documents:
Other References:









Abstract: A thermal interface material (40) includes a macromolecular material (32), and a plurality of carbon nanotubes (22) embedded in the macromolecular material uniformly. The thermal interface material includes a first surface (42) and an opposite second surface (44). Each carbon nanotube is open at both ends thereof, and extends from the first surface to the second surface of the thermal interface material. A method for manufacturing the thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid macromolecular material; (c) solidifying the liquid macromolecular material; and (d) cutting the solidified liquid macromolecular material to obtain the thermal interface material with the carbon nanotubes secured therein.
Claim: What is claimed is:

1. A thermal interface structure comprising: a macromolecular material; and a plurality of carbon nanotubes embedded in the macromolecular material; wherein the thermalinterface structure has a first surface and a second surface opposite to the first surface; and each carbon nanotube is open at opposite ends thereof, and extends from the first surface to the second surface.

2. The thermal interface structure as claimed in claim 1, wherein the first and second surfaces are substantially parallel to each other.

3. The thermal interface structure as claimed in claim 2, wherein the carbon nanotubes are substantially perpendicular to the first and second surfaces.

4. The thermal interface structure as claimed in claim 1, wherein the carbon nanotubes are substantially parallel to each other.

5. The thermal interface structure as claimed in claim 1, wherein a thickness of the thermal interface structure is in the range from 1 to 1000 micrometers.

6. The thermal interface structure as claimed in claim 1, wherein the macromolecular material is selected from the group consisting of a resin, silicone rubber, and rubber.

7. The thermal interface structure as claimed in claim 1, wherein the carbon nanotubes are embedded in the macromolecular material uniformly.

8. A thermal interface material comprising: a macromolecular layer essentially sized as said thermal interface material; and a plurality of carbon nanotubes embedded in said macromolecular layer and pointing toward a same direction, twoopposing ends of each of said plurality of carbon nanotubes exposable to two different surfaces of said thermal interface material and formed to be open and expose an interior of said each of said plurality of carbon nanotubes.

9. The thermal interface material as claimed in claim 8, wherein said macromolecular layer is cut to form said two open ends of said each of said plurality of carbon nanotubes.

10. The thermal interface material as claimed in claim 8, wherein the carbon nanotubes are embedded in the macromolecular layer uniformly.

11. A thermal interface material having a first surface and a second surface opposite to the first surface, the thermal interface material comprising a plurality of carbon nanotubes embedded in a macromolecular layer and extending from thefirst surface to the second surface according to a predetermined direction, the carbon nanotubes each having two open ends exposed out of the first and the second surfaces.

12. The thermal interface material as claimed in claim 11, wherein the macromolecular layer is cut to form the two open ends of each of the carbon nanotubes.

13. The thermal interface material as claimed in claim 11, wherein the first and second surfaces are substantially parallel to each other.

14. The thermal interface material as claimed in claim 13, wherein the carbon nanotubes are substantially perpendicular to the first and second surfaces.

15. The thermal interface material as claimed in claim 11, wherein the carbon nanotubes are substantially parallel to each other.

16. The thermal interface material as claimed in claim 11, wherein a thickness of the thermal interface material is in the range from 1 to 1000 micrometers.

17. The thermal interface material as claimed in claim 11, wherein the macromolecular layer is comprised of a material selected from the group consisting of a resin, silicone rubber, and rubber.

18. The thermal interface material as claimed in claim 11, wherein the carbon nanotubes are embedded in the macromolecular layer uniformly.
Description: BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to thermal interface materials, and more particularly to a thermal interface material which conducts heat by using carbon nanotubes.

2. Description of Related Art

Electronic components such as semiconductor chips are becoming progressively smaller, while at the same time heat dissipation requirements thereof are increasing. Commonly, a thermal interface material is utilized between the electroniccomponent and a heat sink in order to efficiently dissipate heat generated by the electronic component.

A conventional thermal interface material is made by diffusing particles with a high heat conduction coefficient in a base material. The particles can be made of graphite, boron nitride, silicon oxide, alumina, silver, or other metals. However,a heat conduction coefficient of the thermal interface material is now considered to be too low for many contemporary applications, because it cannot adequately meet the heat dissipation requirements of modem electronic components.

A new kind of thermal interface material has recently been developed. The thermal interface material is obtained by fixing carbon fibers with a polymer. The carbon fibers are distributed directionally, and each carbon fiber can provide a heatconduction path. A heat conduction coefficient of this kind of thermal interface material is relatively high. However, the heat conduction coefficient of the thermal interface material is inversely proportional to a thickness thereof, and the thicknessis required to be greater than 40 micrometers. In other words, the heat conduction coefficient is limited to a certain value corresponding to a thickness of 40 micrometers. The value of the heat conduction coefficient cannot be increased, because thethickness cannot be reduced.

An article entitled "Unusually High Thermal Conductivity of Carbon Nanotubes" and authored by Savas Berber (page 4613, Vol. 84, Physical Review Letters 2000) discloses that a heat conduction coefficient of a carbon nanotube can be 6600 W/mK(watts/milliKelvin) at room temperature.

U.S. Pat. No. 6,407,922 discloses another kind of thermal interface material. The thermal interface material is formed by injection molding, and has a plurality of carbon nanotubes incorporated in a matrix material. A first surface of thethermal interface material engages with an electronic device, and a second surface of the thermal interface material engages with a heat sink. The second surface has a larger area than the first surface, so that heat can be uniformly spread over thelarger second surface.

However, the thermal interface material formed by injection molding is relatively thick. This increases a bulk of the thermal interface material and reduces its flexibility. Furthermore, the carbon nanotubes are disposed in the matrix materialrandomly and multidirectionally. This means that heat does not necessarily spread uniformly through the thermal interface material. In addition, the heat does not necessarily spread directly from the first surface engaged with the electronic device tothe second surface engaged with the heat sink.

A new thermal interface material which overcomes the above-mentioned problems is desired.

BRIEF SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a thermal interface material having a reduced thickness, small thermal interface resistance, good flexibility and excellent heat conduction.

To achieve the above-mentioned object, the present invention provides a thermal interface material comprising macromolecular material and a plurality of carbon nanotubes embedded in the macromolecular material uniformly. The thermal interfacematerial also comprises a first surface and an opposite second surface. Each carbon nanotube is open at two ends thereof, and extends from the first surface to the second surface of the thermal interface material.

Unlike in a conventional thermal interface material, the carbon nanotubes of the thermal interface material of the present invention are disposed in the macromolecular material uniformly and directionally. Thus, each carbon nanotube of thethermal interface material can provide a heat conduction path in a direction perpendicular to a main heat absorbing surface of the thermal interface material. This ensures that the thermal interface material has a high heat conduction coefficient. Furthermore, the thickness of the thermal interface material of the present invention can be controlled by cutting the macromolecular material. This further enhances the heat conducting efficiency of the thermal interface material and reduces the volumeand weight of the thermal interface material. Moreover, each carbon nanotube is open at two ends thereof, and extends from the first surface to the second surface of the thermal interface material. This ensures the carbon nanotubes can contact anelectronic device and a heat sink directly. Thus, the thermal interface resistance between the carbon nanotubes and the electronic device is reduced, and the thermal interface resistance between the carbon nanotubes and the heat sink is reduced. Therefore, the heat conducting efficiency of the thermal interface material is further enhanced.

Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side elevation of a substrate having a catalyst film attached thereon according to the present invention;

FIG. 2 is similar to FIG. 1, but showing an array of carbon nanotubes directionally formed on the substrate;

FIG. 3 is similar to FIG. 2, but showing the substrate with the carbon nanotubes immersed in a liquid macromolecular material;

FIG. 4 is similar to FIG. 3, but showing only the substrate, with the carbon nanotubes on the substrate embedded in solidified macromolecular material;

FIG. 5 is similar to FIG. 4, but showing only the solidified macromolecular material with the carbon nanotubes embedded therein after the solidified macromolecular material has been cut; that is, the thermal interface material of the presentinvention; and

FIG. 6 is similar to FIG. 5, but showing the thermal interface material sandwiched between an electronic device and a heat sink.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 1, a substrate 11 having a catalyst film 12 attached thereon is shown. In FIG. 2, an array of carbon nanotubes 22 directionally formed on the substrate 11 is shown. The carbon nanotubes 22 are manufactured by way of thermalchemical vapor deposition or plasma enhanced chemical vapor deposition. In a preferred method of the present invention, the carbon nanotubes 22 are manufactured as follows. Firstly, the substrate 11 is provided. The substrate 11 can be made of glass,quartz, silicon, or alumina. In the preferred embodiment, the substrate 11 is made of porous silicon. A surface of the porous silicon is a porous layer. Diameters of apertures in the porous layer are extremely small, generally about 3 nanometers. Then the catalyst film 12 is uniformly disposed on the substrate 11 by chemical vapor deposition, thermal disposition, electron-beam disposition, or sputtering. The catalyst film 12 can be made of iron (Fe), cobalt (Co), nickel (Ni), or an alloythereof. In the preferred embodiment, the catalyst film 12 is made of iron.

Secondly, the catalyst film 12 is oxidized to obtain catalyst particles (not shown). Then, the substrate 11 with the catalyst particles disposed thereon is placed in a reaction furnace (not shown), and a carbon source gas is provided in thereaction furnace at a temperature of 700-1000.degree. C. to grow the array of carbon nanotubes 22. The carbon source gas can be acetylene or ethene. A height of the array of carbon nanotubes 22 can be controlled by controlling the growth time thereof. Details of the method for growing the array of carbon nanotubes 22 can be found in pages 512-514, Vol. 283, Science 1999, and in pages 11502-11503, Vol. 123, J. Am. Chem. Soc. 2001. Moreover, U.S. Pat. No. 6,350,488 discloses a method for masssynthesis of arrays of carbon nanotubes. These three publications are incorporated herein by reference.

FIG. 3 shows the carbon nanotubes 22 with the substrate 11 immersed in a container 30 of liquid macromolecular material 32. That is, after the growth of the carbon nanotubes 22 is completed, the liquid macromolecular material 32 is provided inorder to completely immerse the carbon nanotubes 22 therewithin. The liquid macromolecular material 32 is selected from the group consisting of resin, silicone rubber, and rubber. In the preferred embodiment, the liquid macromolecular material 32 issilicone rubber. A viscosity of the liquid macromolecular material 32 is required to be below 200 cps (centipoise).

Referring to FIGS. 4 and 5, the substrate 11 having the the carbon nanotubes 22 immersed in the liquid macromolecular material 32 is taken out of the container 30. Then, the liquid macromolecular material 32 is cooled and solidified. Thesolidified macromolecular material 32 with the carbon nanotubes 22 secured therein is peeled off from the substrate 11, and is immersed in liquid paraffin. Then, the liquid paraffin is cooled and solidified. The solidified paraffin has high rigidity,which ensures that the solidified macromolecular material 32 when cut has highly even surfaces. A top portion of the solidified macromolecular material 32 is cut by a cutter (not shown) in a direction perpendicular to the long axes of the carbonnanotubes 22 and at a predetermined elevation thereof. Then a bottom portion of the solidified macromolecular material 32 is cut by the cutter in the same direction at a predetermined elevation. Finally, the solidified paraffin is removed by a suitablesolvent such as xylene, to thereby obtain a thermal interface material 40.

In alternative methods, the liquid macromolecular material 32 can be cooled and solidified while the substrate 11 having the carbon nanotubes 22 remains in the container 30. Then the substrate 11 having the carbon nanotubes 22 secured in thesolidified macromolecular material 32 is taken out of the container 30. Further, the solidified macromolecular material 32 with the carbon nanotubes 22 secured therein can be peeled off from the substrate 11 after the cutting of the top portion of thesolidified macromolecular material 32. In such case, the solidified macromolecular material 32 with the carbon nanotubes 22 secured therein is immersed in liquid paraffin twice: once before the cutting of the top portion of the solidified macromolecularmaterial 32, and a second time before the cutting of the bottom portion of the solidified macromolecular material 32.

Detailedly, the cutting process is performed as follows. Firstly, the top portion of the solidified macromolecular material 32 is cut by the cutter in the direction perpendicular to the long axes of the carbon nanotubes 22. This removes thesolidified macromolecular material 32 upon the carbon nanotubes 22, so that each carbon nanotube 22 is open at a top end thereof. Secondly, the bottom portion of the cut macromolecular material 32 is cut by the cutter in the same direction in order thatthe thermal interface material 40 has a predetermined thickness. Thus, each carbon nanotube 22 is open at a bottom end thereof. The thickness of the thermal interface material 40 is preferably in the range from 1 to 1000 micrometers. In the preferredembodiment, the thickness of the thermal interface material 40 is 20 micrometers.

FIG. 5 shows the thermal interface material 40 of the present invention in isolation. The thermal interface material 40 comprises the solidified macromolecular material 32, and the array of carbon nanotubes 22 embedded in the solidifiedmacromolecular material 32 uniformly. The thermal interface material 40 has a first surface 42, and a second surface 44 opposite to the first surface 42. The carbon nanotubes 22 are substantially parallel to each other, and extend from the firstsurface 42 to the second surface 44. That is, the carbon nanotubes 22 are perpendicular to the first surface 42 and the second surface 44. Thus, each carbon nanotube 22 can provide a heat conduction path in a direction perpendicular to a selected mainheat absorbing surface of the thermal interface material 40. Therefore, the thermal interface material 40 has a high heat conduction coefficient and can conduct heat uniformly.

FIG. 6 shows an application of the thermal interface material 40 of the present invention. The thermal interface material 40 is sandwiched between a heat sink 60 and an electronic device 80, to provide good heat contact between the heat sink 60and the electronic device 80. The first surface 42 of the thermal interface material 40 engages with a surface (not labeled) of the electronic device 80, and the second surface 44 of the thermal interface material 40 engages with a surface (not labeled)of the heat sink 60.

Because solidified paraffin is used in the above-described cutting process, this ensures that the first and second surfaces 42, 44 of the thermal interface material 40 are highly even. In addition, because the thickness of the thermal interfacematerial 40 is on a micron scale, the thermal interface material 40 has good flexibility. Thus, even if the surface of the electronic device 80 is uneven, the thermal interface material 40 can provide good heat contact between the heat sink 60 and theelectrical device 80. Furthermore, each carbon nanotube 22 is open at both ends thereof, and extends from the first surface 42 to the second surface 44 of the thermal interface material 40. This ensures that the carbon nanotubes 22 contact theelectronic device 80 and the heat sink 60 directly. Thus the thermal interface resistance between the carbon nanotubes 22 and the electronic device 80 is reduced, and the thermal interface resistance between the carbon nanotubes 22 and the heat sink 60is reduced. Therefore, the heat conducting efficiency of the thermal interface material 40 is further enhanced.

It is understood that the above-described embodiments and methods are intended to illustrate rather than limit the invention. Variations may be made to the embodiments and methods without departing from the spirit of the invention. Accordingly,it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.

* * * * *
 
 
  Recently Added Patents
Multilayer films having reduced curling
Method and apparatus for reducing and controlling highway congestion to save on fuel costs
Debugging using code analysis
Magnetic storage apparatus
System and methods for obstacle mapping and navigation
Non-volatile flash-RAM memory with magnetic memory
Control of an electric machine
  Randomly Featured Patents
Locking mechanism for folding tool
Light distributor for an X-ray diagnostics installation
Method of transmitting multiple serial signals
Method for repeatable run-out compensation
Device for shortage monitoring inside a sheet collator
Cover for a motor vehicle spare wheel
Toothbrush cleaning system
Method of synchronizing the sequence by which a variety of randomly called unrelated activities are executed in a digital processor
Nitride semiconductor device and fabrication method thereof, and method for forming nitride semiconductor substrate
Method for implanting a flowable fastener