| Patent Number |
Title Of Patent |
Date Issued |
| 7368066 |
Gold CMP composition and method |
May 6, 2008 |
| The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier there |
| 7311856 |
Polymeric inhibitors for enhanced planarization |
December 25, 2007 |
| The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishing system. |
| 7265055 |
CMP of copper/ruthenium substrates |
September 4, 2007 |
| The invention provides a method of chemically-mechanically polishing a substrate. A substrate comprising ruthenium and copper is contacted with a chemical-mechanical polishing system comprising a polishing component, hydrogen peroxide, an organic acid, at least one heterocyclic compound |
| 7001253 |
Boron-containing polishing system and method |
February 21, 2006 |
| The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer |
| 6852632 |
Method of polishing a multi-layer substrate |
February 8, 2005 |
| The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one |
| 6705926 |
Boron-containing polishing system and method |
March 16, 2004 |
| The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or |
| 6527622 |
CMP method for noble metals |
March 4, 2003 |
| The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP systems each comprise an abrasive and/or polishing pad, a liq |
