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Takashi Yamada Patents
Inventor:
Yamada; Takashi
Address:
Tokyo, JP
No. of patents:
242
Patents:


1 2 3 4 5


Patent Number Title Of Patent Date Issued
D462900 Package September 17, 2002
D459459 Electric vaporizer June 25, 2002
D413334 Magnetic head August 31, 1999
D406831 Disc cartridge March 16, 1999
D394249 Magnetic disc for computer May 12, 1998
7420249 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating September 2, 2008
A semiconductor device including a first semiconductor layer formed on a semiconductor substrate, a second semiconductor layer surrounding the first semiconductor layer, the second semiconductor layer being formed on the semiconductor substrate with one of an insulating film and a cavity
7399972 Component for radiation detector and radiation detector July 15, 2008
A group of scintillator elements that convert an incident radiation into a light is one-dimensionally arranged. A photodiode array includes a group of photodiode elements that are arranged corresponding to arrangement positions of the respective scintillator elements, with detection
7366081 Information recording medium April 29, 2008
An information recording medium according to the present invention includes a recording layer that is formed of a single layer of a single type of recording material and is directly sandwiched by a pair of resin layers, the information recording medium being constructed so that at le
7323748 Semiconductor device having epitaxial layer January 29, 2008
A semiconductor device includes a substrate having first and second regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first
7285825 Element formation substrate for forming semiconductor device October 23, 2007
A support-side substrate having a thermal oxide film on the major surface is bonded to an active-layer-side substrate having a thermal oxide film on the major surface while making the major surfaces oppose each other. The active-layer-side substrate and part of the oxide film are sel
7283768 Image forming apparatus October 16, 2007
An image forming apparatus includes an electrophotographic photoreceptor having a conductive substrate; a subbing layer disposed on the conductive substrate and a photosensitive layer disposed on the subbing layer; a charging unit for charging the surface of the photoreceptor; an exposur
7206473 Optical module and optical switch constituting the same April 17, 2007
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be mo
7187035 Semiconductor device comprising multiple layers with trenches formed on a semiconductor substrat March 6, 2007
A method of manufacturing a semiconductor device substrate is disclosed, which comprises forming a mask layer patterned on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically insulating layer, etching the semiconductor layer according to the
7177495 Optical module and optical switch constituting the same February 13, 2007
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be mo
7164559 Head actuator with elastic members oriented at obtuse angles relative to an arm and hard disk ap January 16, 2007
A head actuator is made thinner without sacrificing its strength to thereby achieve the thinning of a hard disk apparatus. On the base end of each of two suspensions is provided a boss that protrudes in the direction of the side on which a magnetic head is provided, and a suspension
7148543 Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation December 12, 2006
A semiconductor chip includes a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer located at the bound
7143426 Multilayer optical recording medium with thickness ranges reducing interlayer cross-talk November 28, 2006
An optical recording medium includes a substrate, a protective layer, three or more information recording layers formed between the substrate and the protective layer and transparent intermediate layers each formed between neighboring information recording layers and capable of recording
7138632 Radiation detector November 21, 2006
A plurality of optical transducers converts the first radiation to a first light having a first wavelength, and converts the second radiation to a second light having a second wavelength. A shielding unit is arranged between the optical transducers to shield the first radiation, the seco
7126279 Display panel with electron-emitting devices on substrates and cathode and anode electrodes October 24, 2006
The front glass substrate and the back glass substrate are placed opposite each other with display cells in between. MIM electron-emitting devices each structured by the opposed cathode electrode and gate electrode sandwiching an insulator layer are arranged in matrix form on the inner
7125593 Optical recording medium October 24, 2006
An optical recording medium including a substrate and a light transmitting layer provided on the substrate so as to have a smaller thickness than that of the substrate, which is hardly warped and excellent in electrical characteristics and productivity, is provided. An optical recording
7116859 Optical module and optical switch constituting the same October 3, 2006
An optical module controls its output characteristics electrically and an optical switch constitutes an optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be mol
7095081 Semiconductor device and manufacturing method thereof August 22, 2006
A semiconductor device includes a substrate having first to fourth regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first
7095040 Electron-emitting device and method of manufacturing the same and display apparatus using the sa August 22, 2006
An electron-emitting device includes an electron source layer made of a metal, a metal alloy or a semiconductor, an insulating layer formed on the electron source layer and a metal thin film electrode formed on the insulating layer. Electrons are emitted upon application of an electric
7075820 Semiconductor memory device for dynamically storing data with channel body of transistor used as July 11, 2006
A semiconductor memory device includes a plurality of MIS transistors arranged at intersections of first word lines and bit lines formed on an SOI substrate and each configuring a memory cell. Each of the plurality of MIS transistors includes a channel body formed in a semiconductor
7075169 Semiconductor device having a hollow region and method of manufacturing the same July 11, 2006
A hollow region is formed in a silicon substrate. A plurality of openings formed in the silicon layer on the hollow region is filled with a buried film. The bottom portion of the hollow region is formed with a plurality of silicon pillars, which support the silicon layer.
7071039 Manufacturing method of partial SOI wafer, semiconductor device using the partial SOI wafer and July 4, 2006
A semiconductor device includes a first semiconductor region having a buried oxide layer formed therein, a second semiconductor region in which the buried oxide layer does not exist, a trench formed to such a depth as to reach at least the buried oxide layer in a boundary portion between
7049661 Semiconductor device having epitaxial layer May 23, 2006
A semiconductor device includes a substrate having first to fourth regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first
7019365 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating March 28, 2006
A semiconductor device according to an aspect of the present invention comprises a first semiconductor layer and a plurality of second semiconductor layers. The first semiconductor layer is formed in a first region of a semiconductor substrate with one of an insulating film and a cav
7018904 Semiconductor chip having multiple functional blocks integrated in a single chip and method for March 28, 2006
A semiconductor chip comprises a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer located at the boun
7018697 Optical recording medium March 28, 2006
An optical recording medium including a substrate and a light transmitting layer provided on the substrate so as to have a smaller thickness than that of the substrate, which is hardly warped and excellent in electrical characteristics and productivity, is provided. An optical recording
6999652 Optical module and optical switch constituting the same February 14, 2006
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be mo
6992417 Bobbin for armature of rotary electrical machine January 31, 2006
An insulator for an armature wherein the insulator is formed with a slot at one end of the teeth on which the coils are wound to trap the end coil to prevent its axial slippage as the coil end is drawn out.
6989228 Method and apparatus for processing samples January 24, 2006
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-proce
6967049 Optical recording medium November 22, 2005
An optical recording medium includes a support substrate, a first resin layer and a second resin layer formed on opposite surface sides of the support substrate, an information recording layer formed between the first resin layer and the support substrate and containing a recording film,
6949848 Terminal for armature September 27, 2005
An electrical armature having a wiring board embodying conductive plates with wire end receiving terminals to receive and hold the wire ends of the coils while they are fused to the terminals.
6933590 Semiconductor device comprising plurality of semiconductor areas having the same top surface and August 23, 2005
A convex polycrystalline silicon film is formed on a handle wafer. A semiconductor layer is formed on the polycrystalline silicon film. The semiconductor is thinner on its areas in which the convex polycrystalline silicon film is formed and is thicker on its areas in which the convex
6906384 Semiconductor device having one of patterned SOI and SON structure June 14, 2005
A semiconductor device includes first and second semiconductor layers and first and second MOS transistors. The first semiconductor layer is provided on and electrically connected to the semiconductor substrate. The second semiconductor layer is provided near the first semiconductor laye
6906372 Semiconductor device with vertical transistor formed in a silicon-on-insulator substrate June 14, 2005
A semiconductor device has an element substrate including a semiconductor layer of a first conductivity type being formed over a semiconductor substrate with a dielectric film interposed therebetween. A groove is formed in the element substrate with a depth extending from a top surface
6872331 Oxide ion conductor, manufacturing method therefor, and fuel cell using the same March 29, 2005
An oxide ion conductor is manufactured having a relatively high mechanical strength while the ionic conduction thereof is maintained at a satisfactory level. The oxide ion conductor is represented by the formula Ln1.sub.1-x A.sub.x Ga.sub.1-y-z-w B1.sub.y B2.sub.z B3.sub.w O.sub.3-d.
6841828 Method of manufacturing SOI element having body contact January 11, 2005
A semiconductor device comprises a semiconductor substrate having a first insulator, and a semiconductor channel region formed on the first insulator, wherein the semiconductor channel region comprising at least two first regions both having the first conductivity type, a second region
6836040 Spindle motor using hydraulic bearing and disk drive on which spindle motor is mounted December 28, 2004
A spindle motor using a hydraulic bearing is provided, wherein an R-face or C-face is formed on each of upper and lower edges of an outer periphery of a rotating disk portion rotatable integrally with a spindle, and the R-face or C-face is formed into a mirror-finished surface having a s
6835981 Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation December 28, 2004
A semiconductor chip comprises a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer located at the boundary
6810497 Semiconductor integrated circuit compensating variations of delay time October 26, 2004
A semiconductor device includes a first circuit and a second circuit cascaded therefrom, a pattern examination section for examining the input signal pattern for the first circuit to estimate a delay in the first circuit, a delay control block for controlling an internal source poten
6787992 Display device of flat panel structure with emission devices of matrix array September 7, 2004
A display device has an emitting region constituted by a plurality of first electrodes provided on a substrate and extending in parallel, a plurality of second electrodes provided on the first electrodes and extending substantially perpendicularly to the first electrodes, and a plurality
6778424 Semiconductor memory device and method of manufacturing the same August 17, 2004
A semiconductor memory device having MIS transistors to constitute memory cells (MC), each of the MIS transistors including a semiconductor layer (12), a source region (15) formed in the semiconductor layer, a drain region (14) formed apart from the source region in the semiconductor
6773857 Electrophotographic photoreceptor, processes for producing the same, process cartridge, and elec August 10, 2004
An electrophotographic photoreceptor having, between an electroconductive substrate and a photosensitive layer, an interlayer which contains fine metal oxide particles and a binder resin and which, when an electric field of 10.sup.6 V/m is applied thereto at 28.degree. C. and 85% RH, has
6744063 Image pickup device including electron-emitting devices June 1, 2004
An image pickup device includes a pair of first and second substrate facing each other with a vacuum space interposed therebetween, and a plurality of electron-emitting devices provided over said first substrate and a photoconductive layer provided over said second substrate. Each el
6719217 Aromatizer April 13, 2004
The invention provides an air fragrance device (10) having a fan (26) driven by a motor (24) and provided in a blowing chamber (35) and an air fragrance tank (13) having a fragrant agent (1) therein and communicated with the blowing chamber (35), in which the blowing chamber (35) is
6700132 Flat panel display device utilizing electron emission devices March 2, 2004
A display device includes a backside and a front-side substrates facing each other with a vacuum space therebetween; and a plurality of electron emission sites provided on the backside substrate. Each electron emission sites includes a bottom electrode formed on a surface of the backside
6663188 Wheel cover December 16, 2003
A cover body (22) has mounting claws (25), which are provided on a peripheral part thereof and restrained by a wire ring (23) from deforming toward the center of the cover body. The cover body is attached to a disc wheel of a vehicle by these mounting claws in such a way as to cover an
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