| Patent Number |
Title Of Patent |
Date Issued |
| 7138039 |
Liquid isolation of contact rings |
November 21, 2006 |
| Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate su |
| 6951599 |
Electropolishing of metallic interconnects |
October 4, 2005 |
| Embodiments of the present invention generally relate to a method and apparatus for planarizing a substrate by electropolishing techniques. Certain embodiments of an electropolishing apparatus include a contact ring adapted to support a substrate, a cell body adapted to hold an elect |
| 6905622 |
Electroless deposition method |
June 14, 2005 |
| Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and d |
| 6899816 |
Electroless deposition method |
May 31, 2005 |
| Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and d |
| 6830673 |
Anode assembly and method of reducing sludge formation during electroplating |
December 14, 2004 |
| A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the elec |
| 6723224 |
Electro-chemical polishing apparatus |
April 20, 2004 |
| Generally, a method and apparatus for electro-chemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electro-chemical polishing apparatus generally includes a substrate support having a plurality of contact members, a cathode and at least one noz |
| 6521118 |
Semiconductor etching process and apparatus |
February 18, 2003 |
| There is provided a process for etching a semiconductor material, comprising the steps of: providing an electrochemical cell containing an etching electrolyte, the etching electrolyte being selected from the group of acidic electrolyte solutions, alkaline solutions, neutral solutions, |
| 5567551 |
Method for preparation of mask for ion beam lithography |
October 22, 1996 |
| A mask for ion beam lithography is made by coating a front side, sidewalls, nd a backside of a substrate with an insulating layer; opening, on the front side of the substrate, a window in the insulating layer to expose a front substrate surface; depositing an oxide membrane on the front |
| 5382347 |
Protective coatings for metal parts to be used at high temperatures |
January 17, 1995 |
| A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before or simultaneously with last anodic oxidation step |
| 5158663 |
Protective coatings for metal parts to be used at high temperatures |
October 27, 1992 |
| A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before the last anodic oxidation step. The treated metal |
| 5116469 |
Method for treatment of high-strength metal against hydrogen embrittlement |
May 26, 1992 |
| A method is described for treating high strength metals selected from zirconium, titanium and alloyed steels, against hydrogen embrittlement. The method involves the immersion of the metal in an electrolyte solution and subjecting it to an anodic potential having a value of up to 600 vol |
| 5096791 |
Method for preparation of mask for X-ray lithography |
March 17, 1992 |
| A method of obtaining a mask for X-ray lithography having a thin oxidized metal membrane supported on an annular silicon base. The method consists of the following steps: (a) deposition of a metal layer on a silicon wafer; (b) oxidation of the metal layer to form a continuous thin oxide |
| 5057388 |
Method for the preparation of mask for X-ray lithography |
October 15, 1991 |
| A method of obtaining a mask for X-ray lithography having a thin oxide film supported on an annular silicon base includes the following steps:(a) deposition of an oxide layer such as titania or zirconia, on a silicon or copper substrate;(b) etching selectively a portion of the backside of th |
| 4652348 |
Method for the production of alloys possessing high elastic modulus and improved magnetic proper |
March 24, 1987 |
| The present invention relates to a method for the electrodeposition of an ordered alloy structured in alternate discrete layers said alloys possessing high elastic modulus and adjustable magnetic susceptibility. According to the invention, the electrodeposition of at least two metals, |
| 4316779 |
Process for electroplating palladium on articles comprising copper |
February 23, 1982 |
| A process and bath composition is described for the electroplating of palladium. The bath contains a source of palladium and thiourea or related compounds to prevent poisoning of the bath from copper ions contained on surfaces to be plated. It is particularly useful in palladium elec |
| 4299670 |
Palladium plating procedure and bath |
November 10, 1981 |
| A process for electrodepositing palladium. The article to be coated is exposed to a benzotriazole compound for preventing interference by copper ions in the plating bath. The article may be exposed either by a predip in a solution comprising a benzotriazole compound or the compound may b |
| 4284482 |
Palladium treatment procedure |
August 18, 1981 |
| A process is described for treating palladium and palladium alloys so as to render them ductile and wear resistant. The process involves an electrochemical treatment which is relatively easy to carry out and is suitable for commerical use. Palladium surfaces and films treated with th |
