| Patent Number |
Title Of Patent |
Date Issued |
| 7342803 |
Printed circuit board and method of manufacturing printed circuit board |
March 11, 2008 |
| A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrat |
| 7307852 |
Printed circuit board and method for manufacturing printed circuit board |
December 11, 2007 |
| Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large th |
| 6876554 |
Printing wiring board and method of producing the same and capacitor to be contained in printed |
April 5, 2005 |
| Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large th |
| 6724638 |
Printed wiring board and method of producing the same |
April 20, 2004 |
| A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makesit possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate |
| 6492255 |
Semiconductor chip and method manufacturing the same |
December 10, 2002 |
| A via 42 is formed by copper plating on a surface of an aluminum electrode pad 32 of a semiconductor chip 30. Since the via 42 having flexibility absorbs a stress generated due to a difference in thermal expansion between the semiconductor chip 30 and a substrate, the semiconductor chip |
