Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Min-Qi Xiao Patents
Inventor:
Xiao; Min-Qi
Address:
Guangdong, CN
No. of patents:
8
Patents:




Patent Number Title Of Patent Date Issued
7447020 Heat sink assembly November 4, 2008
A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a
7395851 Heat dissipation device July 8, 2008
A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the
7385825 Heat dissipation device June 10, 2008
A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping
7343962 Heat sink March 18, 2008
A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages.
7298621 Heat sink November 20, 2007
A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating
7295437 Heat dissipation device for multiple heat-generating components November 13, 2007
A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (14) and the second heat sink comprises a
7278470 Heat dissipation device October 9, 2007
A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fin
7269012 Heat dissipation device for heat-generating electronic component September 11, 2007
A heat dissipation device includes a first heat sink (10), a second heat sink (20), a pair of heat pipes (30) connecting the first heat sink and the second heat sink and a fan assembly (40) located between the first heat sink and the second heat sink. The first heat sink comprises a base


 
 
  Recently Added Patents
Bi-directional universal serial bus booster circuit
Method of fabricating a semiconductor device
Fresh water intake monitoring system and method
Method of accumulating foreign gene product in plant seed at high level
Multi-axis joystick and transducer means therefore
Period indicator
System and method for identifying molecules
  Randomly Featured Patents
Cargo sling system for a helicopter
Process for producing a desired breaking point on a glass body
Novel process
Container
Storage management system
Scent dispenser and method
Integrated optical device
Error-corrected corpuscular beam lithography
Method for forming a ruthenium metal layer
Cover holder for a photograph album