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Kalu K. Vasoya Patents |
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Inventor: Vasoya; Kalu K.
Address: Placentia, CA
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7301105 |
Printed wiring boards possessing regions with different coefficients of thermal expansion |
November 27, 2007 |
| Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one embodiment, the inve |
| 7173325 |
Expansion constrained die stack |
February 6, 2007 |
| Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection components. At least one of the printed wiring board assemblies includes an interposer |
| 6869664 |
Lightweight circuit board with conductive constraining cores |
March 22, 2005 |
| Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electric |
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