| Patent Number |
Title Of Patent |
Date Issued |
| 7372120 |
Methods and apparatus to optically couple an optoelectronic chip to a waveguide |
May 13, 2008 |
| Methods and apparatus to optically couple an optoelectronic chip to a waveguide are disclosed. A disclosed apparatus includes a substrate, a waveguide mounted on the substrate and an optoelectronic chip bonded to the substrate and having an optical element directly engaging the waveg |
| 7283699 |
Optical package |
October 16, 2007 |
| Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first wav |
| 7195941 |
Optical devices and methods to construct the same |
March 27, 2007 |
| Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to rece |
| 7085449 |
Waveguide coupling mechanism |
August 1, 2006 |
| A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide. |
| 7038316 |
Bumpless die and heat spreader lid module bonded to bumped die carrier |
May 2, 2006 |
| An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier. |
| 6992381 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
January 31, 2006 |
| An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generatin |
| 6888240 |
High performance, low cost microelectronic circuit package with interposer |
May 3, 2005 |
| A low cost technique for packaging microelectronic circuit chips fixes a die within an opening in a package core. At least one metallic build up layer is then formed on the die/core assembly and a grid array interposer unit is laminated to the build up layer. The grid array interposer un |
| 6720814 |
Electronic package with integrated clock distribution structure |
April 13, 2004 |
| An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock |
| 6593793 |
Electronic package with integrated clock distribution structure |
July 15, 2003 |
| An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock |
