| |
 |
Kaichi Ueno Patents |
|
Inventor: Ueno; Kaichi
Address: Sanda, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5847466 |
Semiconductor device and manufacturing method for the same |
December 8, 1998 |
| A semiconductor device having a multilayer interconnection structure, includes a substrate having a metal interconnect layer provided thereon and N number (N being an integer of 2 or greater) of layers of insulating film formed one on top of another on the substrate. Each layer of in |
|
|
|
