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Toyoichi Ueda Patents |
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Inventor: Ueda; Toyoichi
Address: Katsuta, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 4803543 |
Semiconductor device and process for producing the same |
February 7, 1989 |
| In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an ep |
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