Alignment-mark patterns are disclosed that are defined on stencil reticles and that can be transferred lithographically from the reticle to a sensitized substrate using charged-particle-beam microlithography. The corresponding alignment marks as transferred to the substrate are detec
Devices and methods are disclosed for monitoring temperature of certain components (e.g., lenses, deflectors, and stages) in real time during operation of a microlithography apparatus, especially a charged-particle-beam microlithography apparatus. The components have associated there
