Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Sugio Uchida Patents Inventor: Uchida; Sugio Address: Nagano, JP No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 5200362 Method of attaching conductive traces to an encapsulated semiconductor die using a removable tra April 6, 1993 A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around th       Recently Added Patents Morpholinyl and pyrrolidinyl analogs Anti-KC4 humanized monoclonal antibody and cells that express the antibody Halftone-image processing device Method and system of determining whether a user program has made a system level call Utilizing cache information to manage memory access and cache utilization Surface oxidised nickel-iron metal anodes for aluminium production Method for producing a belt structure for a vehicle tyre and vehicle tyre including the belt structure   Randomly Featured Patents Micromirror and post arrangements on substrates Process for preparing tert-butylstyrene Binder with translucent covers Portable acoustic impedance data acquisition and analysis system Microfluidic writing pen Organizer Replication of hepatitis C virus genome and identification of virus having high infectivity Use of chlorous acid for removing sulfur dioxide from combustion gases Razor lube bar Q-quenching super-regenerative receiver © 2006. PatentGenius. All Rights Reserved.