| Patent Number |
Title Of Patent |
Date Issued |
| 7163885 |
Method of migrating and fixing particles in a solution to bumps on a chip |
January 16, 2007 |
| A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor wit |
| 6989325 |
Self-assembled nanometer conductive bumps and method for fabricating |
January 24, 2006 |
| A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is |
| 6539624 |
Method for forming wafer level package |
April 1, 2003 |
| A method for forming a wafer level package that is equipped with solder balls on a top surface and encapsulated by a stress buffer layer of an elastomeric material is disclosed. The method can be carried by first forming a plurality of solder balls on bond pads provided on a top surface |
| 6440836 |
Method for forming solder bumps on flip chips and devices formed |
August 27, 2002 |
| The present invention discloses a dual-photoresist method for forming fine-pitched solder bumps on flip chips by utilizing two separate layers of photoresist, i.e., a first thin photoresist layer for patterning the BLM layers on top of the aluminum bonding pads and a second thick pho |
| 6268114 |
Method for forming fine-pitched solder bumps |
July 31, 2001 |
| A method for forming solder balls that have larger spacings between them and electronic devices containing such solder balls are disclosed. In the method, an additional layer of a leachable metal such as gold or silver is used between an under bump metallurgy layer and a solder bump subs |
| 6179200 |
Method for forming solder bumps of improved height and devices formed |
January 30, 2001 |
| A method for forming solder balls that have improved height on an electronic substrate such as a silicon wafer and devices formed are disclosed. In the method, after solder bumps are deposited by a conventional method such as evaporation, electroplating, electroless plating or solder |
