An apparatus detects the presence or absence of a semiconductor device. The apparatus includes a wire bonding machine to form a connection with the semiconductor device, and a camera to form an image of a position of the semiconductor device. A processor controls the wire bonding machine
A method of fabricating a semiconductor device which includes providing a shaped bond pad, preferably rectangular or oval. A cavity followed by a hill are formed in the bond pad by performing a probe test at one end portion of the bond pad. Then a ball bond is formed on the bond pad remo
