| Patent Number |
Title Of Patent |
Date Issued |
| 7406228 |
Backlight module structure for LED chip holder |
July 29, 2008 |
| The present invention provides a backlight module for a light emitting device (LED) chip holder. The backlight module includes a top guide-light board, a bottom guide-light board, a chip holder with an inclined plane thereon, and a light emitting diode chip. One side of the top guide-lig |
| 7405519 |
Flat fluorescent lamp and driving method thereof |
July 29, 2008 |
| A flat fluorescent lamp is provided. Wherein, a discharge gas is disposed in a chamber, and a fluorescent material is disposed on a first inner wall and a second inner wall of the chamber. First electrode sets are disposed on the first inner wall, and second electrode sets aligned with |
| 7165856 |
Light-duide plate and backlight module |
January 23, 2007 |
| A light-guide plate comprising a light-guide board having a first refractive index and at least one light-guide part buried inside the light-guide board is provided. The light-guide part has a second refractive index larger than the first refractive index. The light-guide board and t |
| 6881980 |
Package structure of light emitting diode |
April 19, 2005 |
| The present invention relates to a package structure for a light emitting diode (LED). The LED package structure of this invention includes a package housing having at least a trench and at least two leads. The package structure includes at least a die or an LED chip disposed on the |
| 6602338 |
Titanium dioxide film co-doped with yttrium and erbium and method for producing the same |
August 5, 2003 |
| A precursor composition of TiO.sub.2 doped with erbium (Er) and yttrium (Y) for forming a film used in a planar optical waveguide amplifier. The precursor composition includes 100 mol % TiO.sub.2 precursor compound, about 0.1-10 mol % erbium ion (Er.sup.3+) precursor compound, and about |
