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Masashi Tachibana Patents |
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Inventor: Tachibana; Masashi
Address: Hyogo, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6630630 |
Multilayer printed wiring board and its manufacturing method |
October 7, 2003 |
| A multilayer printed wiring board includes (a) an inner layer material that includes an insulating substrate, an inner conductive pattern formed of a metal foil and disposed on both sides of the insulating substrate, respectively, and an interstitial via hole, (b) an insulating resin |
| 6270607 |
Method of manufacturing multilayer printed wiring board |
August 7, 2001 |
| Photosensitive resin is applied to an internal conductive pattern layer (2) as well as to an inside layer which has a hole (3a) filled with conductive paste (3b). A hole (4a) communicating to the internal conductive pattern layer (2) by exposure and development is formed. Then, metal pla |
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