| Patent Number |
Title Of Patent |
Date Issued |
| 7413987 |
Method for manufacturing a semiconductor device |
August 19, 2008 |
| There is disclosed a method of manufacturing a semiconductor device, wherein an Si.sub.3N.sub.4 film is formed as a mask member on the surface of a silicon substrate, then etched to form an STI trench. A solution of perhydrogenated silazane polymer is coated on the surface of the silicon |
| 7407864 |
Polysilazane perhydride solution and method of manufacturing a semiconductor device using the sa |
August 5, 2008 |
| Disclosed is a method of manufacturing a semiconductor device comprising forming an element isolation trench in a semiconductor substrate, coating a polysilazane perhydride solution on the semiconductor substrate having the element isolation trench formed thereon to form a polysilazane |
| 7390759 |
Steel plate reinforcing sheet |
June 24, 2008 |
| The invention provides a steel plate reinforcing sheet having light weight and thin layer, providing sufficient adhesion and reinforcing effect to a steel plate, and having excellent workability. In the steel plate reinforcing sheet comprising a restricting layer and a resin layer, a |
| 7336373 |
Surface shape measuring apparatus and surface shape measuring method |
February 26, 2008 |
| In order to provide a surface shape measuring apparatus and a surface shape measuring method capable of detecting a distortion on the curved surface of a work precisely, a laser displacement meter 17 disposed to the outside surface of a door panel 51 of a curved shape at a confronting |
| 7267870 |
Pressure-sensitive adhesive sheet for steel plates |
September 11, 2007 |
| A pressure-sensitive adhesive sheet for steel plates, which comprises a backing and a resin layer, wherein the backing comprises a resin-coated glass cloth obtainable by coating a glass cloth with a resin emulsion (A) followed by coating with a resin emulsion (B) which is different from |
| 7071107 |
Method for manufacturing a semiconductor device |
July 4, 2006 |
| There is disclosed a method of manufacturing a semiconductor device, wherein an Si.sub.3N.sub.4 film is formed as a mask member on the surface of a silicon substrate, then etched to form an STI trench. A solution of perhydrogenated silazane polymer is coated on the surface of the silicon |
| 6805953 |
Waterstop sealing material |
October 19, 2004 |
| In accordance with the present invention, a foamed structure having closed cells or both closed cells and open cells can be effectively used as a waterstop sealing material. In particular, a waterstop sealing material having excellent sealing properties can be provided. The waterstop sea |
| 4065298 |
Steel making process by oxygen top-blown converter |
December 27, 1977 |
| In a steel making process with an oxygen top-blown converter when a certain inclining angle (.theta.) is given within a range of 0<.theta..ltoreq.15.degree. to normal axis of an oxygen blow lance being supported at an upper portion of the lance and a certain number of rotation (.n |
| 4043801 |
Method of simultaneously controlling temperature and carbon content of molten steel at the end-p |
August 23, 1977 |
| In the refining of steel by an oxygen topblown converter, the temperature and carbon content of molten steel are simultaneously measured by a sensor at a predetermined time before the end point, whereby in accordance with the difference between a calculated carbon content at the endpoint |
