| Patent Number |
Title Of Patent |
Date Issued |
| 7417444 |
Method and apparatus for inspecting integrated circuit pattern |
August 26, 2008 |
| A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while |
| 7301146 |
Probe driving method, and probe apparatus |
November 27, 2007 |
| A probe driving method and a probe apparatus for bringing a probe into contact with the surface of a sample in a safe and efficient manner by monitoring the probe height. Information about the height of the probe from the sample surface is obtained by detecting a probe shadow (54) ap |
| 7266235 |
Pattern inspection method and apparatus |
September 4, 2007 |
| A pattern inspection method in which an image can be detected without an image detection error caused by an adverse effect to be given by such factors as ions implanted in a wafer, pattern connection/non-connection, and pattern edge formation. A digital image of an object substrate is |
| 7260256 |
Method and system for inspecting a pattern |
August 21, 2007 |
| The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in |
| 7133550 |
Pattern inspection method and apparatus |
November 7, 2006 |
| A pattern inspection method in which an image can be detected without an image detection error caused by an adverse effect to be given by such factors as ions implanted in a wafer, pattern connection/non-connection, and pattern edge formation. A digital image of an object substrate is |
| 7122796 |
Electron beam inspection method and apparatus and semiconductor manufacturing method and its man |
October 17, 2006 |
| An inspection method and apparatus includes control of an acceleration voltage of an electron beam, irradiation of the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, and detection of at least one of secondary elec |
| 7026830 |
Method and apparatus for inspecting integrated circuit pattern |
April 11, 2006 |
| To make possible the in-line inspection of a pattern of an insulating material.A patterned wafer 40 formed with a pattern by a resist film is placed on a specimen table 21 of a patterned wafer inspection apparatus 1 in opposed relation to a SEM 3. An electron beam 10 of a large current i |
| 6970004 |
Apparatus for inspecting defects of devices and method of inspecting defects |
November 29, 2005 |
| Disconnection defects, short-circuit defects and the like in wiring patterns of submicron sizes within TEGs (a square of 1 to 2.5 mm for each) numerously arranged in a large chip (a square of 20 to 25 mm) can be inspected with respect to all the TEGs, with good operability, high reli |
| 6960765 |
Probe driving method, and probe apparatus |
November 1, 2005 |
| A probe driving method and a probe apparatus for bringing a probe into contact with the surface of a sample in a safe and efficient manner by monitoring the probe height. Information about the height of the probe from the sample surface is obtained by detecting a probe shadow appearing |
| 6944325 |
Inspecting method and apparatus for repeated micro-miniature patterns |
September 13, 2005 |
| An apparatus for inspecting foreign matter in repeated micro-miniature patterns formed upon a surface of an object to be inspected, comprising: an inspection light illuminating device for irradiating an inspection light directed upon the surface of the object to be inspected, on which |
| 6895346 |
Method for test conditions |
May 17, 2005 |
| A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to t |
| 6841405 |
Photomask for test wafers |
January 11, 2005 |
| A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to t |
| 6828554 |
Electron beam inspection method and apparatus and semiconductor manufacturing method and its man |
December 7, 2004 |
| A method of detecting a defect includes of determining an image acquisition condition for irradiating a converged electron beam onto a specimen and detecting a secondary electron emanated from the specimen, acquiring an image by detecting the secondary electron emanated from the specimen |
| 6780660 |
System for testing electronic devices |
August 24, 2004 |
| A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to t |
| 6771077 |
Method of testing electronic devices indicating short-circuit |
August 3, 2004 |
| A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to t |
| 6770496 |
Method of testing electronic devices |
August 3, 2004 |
| A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to t |
| 6760472 |
Identification method for an article using crystal defects |
July 6, 2004 |
| A semiconductor substrate has a peculiar crystal defect. Crystal defects in a fixed area of a substrate can be treated as data acquired by coding the distribution of the crystal defects. The coded data is utilized for certificate data of an IC card by identifying a semiconductor substrat |
| 6734687 |
Apparatus for detecting defect in device and method of detecting defect |
May 11, 2004 |
| Disconnection defects, short-circuit defects and the like in wiring patters of submicron sizes within TEGs (a square of 1 to 2.5 mm for each) numerously arranged in a large chip (a square of 20 to 25 mm) can be inspected with respect to all the TEGs, with good operability, high relia |
| 6717142 |
Electron beam inspection method and apparatus and semiconductor manufacturing method and its man |
April 6, 2004 |
| An inspection method and apparatus includes control of an acceleration voltage of an electron beam, irradiation of the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, and detection of at least one of secondary electron |
| 6703850 |
Method of inspecting circuit pattern and inspecting instrument |
March 9, 2004 |
| In order to obtain optimum irradiation conditions of an electron beam according to the material and structure of a circuit pattern to be inspected and the kind of a failure to be detected and inspect under the optimum conditions without delay of the inspection time, an inspection dev |
| 6661912 |
Inspecting method and apparatus for repeated micro-miniature patterns |
December 9, 2003 |
| An apparatus for inspecting foreign matter in repeated micro-miniature patterns formed upon a surface of an object to be inspected, comprising: an inspection light illuminating device for irradiating an inspection light directed upon the surface of the object to be inspected, on which |
| 6583634 |
Method of inspecting circuit pattern and inspecting instrument |
June 24, 2003 |
| In order to obtain optimum irradiation conditions of an electron beam according to the material and structure of a circuit pattern to be inspected and the kind of a failure to be detected and inspect under the optimum conditions without delay of the inspection time, an inspection dev |
| 6573546 |
Semiconductor integrated circuit device and process for manufacturing the same |
June 3, 2003 |
| A field oxide film 3 in a region where relief cells are formed is made wider than the field oxide film 3 in a region where normal memory cells are formed thereby to make a field relaxation layer 8r of the relief cells deeper than the field relaxation layer 8 of the normal cells, and the |
| 6559663 |
Method and apparatus for inspecting integrated circuit pattern |
May 6, 2003 |
| A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scan |
| 6376854 |
Method of inspecting a pattern on a substrate |
April 23, 2002 |
| A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction |
| 6373054 |
Electron beam inspection method and apparatus and semiconductor manufacturing method and its man |
April 16, 2002 |
| An inspection method and apparatus which controls an acceleration voltage of an electron beam, irradiates the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, detects at least one of a secondary electron and a reflected |
| 6365425 |
Method of manufacturing semiconductor device |
April 2, 2002 |
| A method of manufacturing a semiconductor device includes fetching inspection chip information including information of a dust-particle/fault on an inspection chip by irradiating the inspection chip of a semiconductor wafer with an optical beam and by detecting the scattering/diffrac |
| 6347150 |
Method and system for inspecting a pattern |
February 12, 2002 |
| The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in |
| 6329826 |
Method and apparatus for inspecting integrated circuit pattern |
December 11, 2001 |
| A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scan |
| 6291847 |
Semiconductor integrated circuit device and process for manufacturing the same |
September 18, 2001 |
| A field oxide film 3 in a region where relief cells are formed is made wider than the field oxide film 3 in a region where normal memory cells are formed thereby to make a field relaxation layer 8r of the relief cells deeper than the field relaxation layer 8 of the normal cells, and the |
| 6236057 |
Method of inspecting pattern and apparatus thereof with a differential brightness image detectio |
May 22, 2001 |
| A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a s |
| 6172365 |
Electron beam inspection method and apparatus and semiconductor manufacturing method and its man |
January 9, 2001 |
| An electron beam inspection method including the steps of irradiating an electron beam to an object to be inspected, detecting at least one of a secondary electron and a reflected electron emanated from the object by the irradiation of the electron beam, and obtaining an image of the obj |
| 6172363 |
Method and apparatus for inspecting integrated circuit pattern |
January 9, 2001 |
| A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scan |
| 6087673 |
Method of inspecting pattern and apparatus thereof |
July 11, 2000 |
| In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an |
| 5986263 |
Electron beam inspection method and apparatus and semiconductor manufacturing method and its man |
November 16, 1999 |
| An electron beam inspection method and apparatus. The method includes controlling acceleration voltage of electron beam and electric field on a sample, beam current, beam diameter, image detection rate, image dimensions, precharge, discharge, or a combination of them, exposing an obj |
| 5877498 |
Method and apparatus for X-ray analyses |
March 2, 1999 |
| An X-ray analyzing method for inspecting opening states of fine holes comprises the steps of: irradiating a finely converged electron beam into a first fine hole, observing an X-ray emitted from the inside of said first fine hole in order to obtain an first X-ray analysis data about the |
