| |
 |
Jea-shik Shin Patents |
|
Inventor: Shin; Jea-shik
Address: Suwon-si, KR
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7408434 |
Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufact |
August 5, 2008 |
| An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil elec |
| 7341888 |
Balance filter packaging chip having balun mounted therein and manufacturing method thereof |
March 11, 2008 |
| A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device sub |
| 7173324 |
Wafer level package for micro device |
February 6, 2007 |
| A wafer level package includes a device wafer having a micro device, and bonding pads which are connected to the micro device, and formed at one surface of the device wafer, via connectors extending from the bonding pads to the other surface of the device wafer, external bonding pads |
| 7042312 |
Ladder-type bulk acoustic wave filter with common ground inductor |
May 9, 2006 |
| A ladder-type bulk acoustic wave filter includes an input terminal, an output terminal, a ground terminal, a plurality of series resonators connected in series between the input terminal and the output terminal, a plurality of shunt resonators, and a common ground inductor. Each shunt |
|
|
|
