| Patent Number |
Title Of Patent |
Date Issued |
| 7352184 |
MRI apparatus with high-resistance magnet |
April 1, 2008 |
| Eddy current generated around a magnetic circuit in an MRI apparatus is one of the causes of deviation from an ideal magnetic field gradient waveform and causes image distortion, loss of strength, ghost generation, loss of signal, and spectral distortion. An object of the present inv |
| 7220481 |
High dielectric constant composite material and multilayer wiring board using the same |
May 22, 2007 |
| A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility wi |
| 7179340 |
Rare-earth magnet and manufacturing method thereof and magnet motor |
February 20, 2007 |
| The object of the present invention is to provide a rare earth magnet which enables to achieve a good balance between high coercive force and high residual magnetic flux density, and its manufacturing method. The present invention provides a rare earth magnet in which a layered grain |
| 7112634 |
Thermosetting resin composition |
September 26, 2006 |
| A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula ##STR00001## wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R.sup.5 a |
| 7108939 |
Covalently bonded catalyst carrier and catalytic component |
September 19, 2006 |
| A catalytic material and electrode of the present invention are characterized in that the catalyst carrier constituting the above-mentioned catalytic material and electrode includes at least one member selected from the group consisting of nitrogen atoms, oxygen atoms, phosphor atoms |
| 7105246 |
Catalytic material, electrode, and fuel cell using the same |
September 12, 2006 |
| A catalytic material and electrode of the present invention are characterized in that the catalyst carrier constituting the above-mentioned catalytic material and electrode includes at least one member selected from the group consisting of nitrogen atoms, oxygen atoms, phosphor atoms |
| 6946405 |
Polyparaxylylene film, production method therefor and semiconductor device |
September 20, 2005 |
| An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film. |
| 6946198 |
Solvent-free thermosetting resin composition, process for producing the same, and product theref |
September 20, 2005 |
| A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition |
| 6924971 |
High dielectric constant composite material and multilayer wiring board using the same |
August 2, 2005 |
| A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with |
| 6821657 |
Solvent-free thermosetting resin composition, process for producing the same, and product theref |
November 23, 2004 |
| A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition |
| 6762511 |
Thermosetting resin composition |
July 13, 2004 |
| A device allows for continuous regulation of the composition of a fluid mixture that includes at least two components of different polarities. The device is designed, for example, to be inserted in a separation system that the device supplies with a carrier fluid of stabilized compositio |
| 6638631 |
Thermal stable low elastic modulus material and device using the same |
October 28, 2003 |
| The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of -50.degree. C. to 300.degree. C., has an |
| 6638352 |
Thermal stable low elastic modulus material and device using the same |
October 28, 2003 |
| The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of -50.degree. C. to 300.degree. C., has an |
| 6344273 |
Treatment solution for forming insulating layers on magnetic particles process for forming the i |
February 5, 2002 |
| The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with |
| 6225418 |
Thermosetting resin composition |
May 1, 2001 |
| A thermosetting resin composition obtained by heat treating, under the specified conditions, a mixture of a polyaddition thermosetting resin, a silicic compound (oligomer) having a functional group capable of causing an addition reaction with a curing agent for the polyaddition therm |
| 6054219 |
Process for forming insulating layers on soft magnetic powder composite core from magnetic parti |
April 25, 2000 |
| The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with |
| 5768108 |
Multi-layer wiring structure |
June 16, 1998 |
| A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high |
| 5712080 |
Method for manufacturing printed circuit board |
January 27, 1998 |
| A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of |
| 5686191 |
Thin film wiring board |
November 11, 1997 |
| A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellen |
| 5178962 |
Metal-organic macromolecular synthetic resin composite and process for producing the same |
January 12, 1993 |
| A composite of metal and an organic film having a high adhesiveness without deterioration of film quality is provided by exposing the surface of organic film to at least one of chemically reactive gas phase molecules and gas phase ions thereby forming functional groups on the surface of |
