| Patent Number |
Title Of Patent |
Date Issued |
| 7005607 |
Welding method, welding device, welded joint, and welded structure |
February 28, 2006 |
| A welding method is disclosed for butt welding a first base material 1 and a second base material 2 with each other. To also permit stable and efficient formation of a bead in the form of a fillet weld on a back side of a groove by conducting arc welding from the side of the groove witho |
| 6596969 |
Method for guiding arc by laser, and arc guiding welding and device by the method |
July 22, 2003 |
| In an arc welding method and apparatus, a plasma (13) is generated at a welding intended position on a base material (2) by a laser (16) irradiated to the base material (2). When a discharge electrode (12) is at a minus potential, an arc discharge (4) takes place in the direction of |
| 5763853 |
Laser processing apparatus, laser processing method and dam bar processing method |
June 9, 1998 |
| Detecting light from a detecting light source (122) is irradiated to a workpiece (1) and the reflected light is detected by a photosensor (126). At the same time, light resulting from emission of plume produced upon laser processing is also detected by the photosensor (126). A laser |
| 5662822 |
Dam bar cutting apparatus and dam bar cutting method |
September 2, 1997 |
| The array condition of leads (3) is detected by a photoelectric detector (41), the detection signal is subjected to signal processing to determine the timing to oscillate a pulsed laser beam, and a laser beam axis (13C) is relatively moved at a speed (v.sub.0) with a work table (21) whil |
| 5632083 |
Lead frame fabricating method and lead frame fabricating apparatus |
May 27, 1997 |
| A lead frame fabricating method and a lead frame fabricating apparatus are provided which can easily fabricate lead frames of fine pattern at a high speed, can improve dimensional accuracy and quality of the lead frames after the fabrication, and can realize mass-production at a lower co |
| 5580466 |
Metal plate processing method, lead frame processing method, lead frame, semiconductor device ma |
December 3, 1996 |
| An object of the present invention is to, in methods of processing metal plates and lead frames, enable workpieces to be finely processed into a satisfactory configuration with high dimensional accuracy without suffering the effect of heat produced under irradiation of a laser beam. |
| 5548890 |
Lead frame processing method |
August 27, 1996 |
| In a method for forming a lead frame (1) from a metallic plate, a metallic plate (11) is first etched to form outer leads (4) and outer portions (3b) of inner leads of the lead frame (1). Inner portions (3a) of the inner leads (3) are then laser-cut under the condition that a joint porti |
