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William Sablinski Patents |
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Inventor: Sablinski; William
Address: Beacon, NY
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6892925 |
Solder hierarchy for lead free solder joint |
May 17, 2005 |
| A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains suff |
| 6854636 |
Structure and method for lead free solder electronic package interconnections |
February 15, 2005 |
| An electronic package having a solder interconnect liquidus temperature hierarchy to limit the extent of the melting of the C4 solder interconnect during subsequent second level join/assembly and rework operations. The solder hierarchy employs the use of off-eutectic solder alloys of Sn/ |
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