| Patent Number |
Title Of Patent |
Date Issued |
| RE39143 |
Method for making a wafer-pair having sealed chambers |
June 27, 2006 |
| A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low |
| 7396698 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate |
July 8, 2008 |
| A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and ad |
| 7396476 |
Method for reducing harmonic distortion in comb drive devices |
July 8, 2008 |
| Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberati |
| 7276798 |
Integral topside vacuum package |
October 2, 2007 |
| An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a |
| 7012322 |
Method for reducing harmonic distortion in comb drive devices |
March 14, 2006 |
| Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberati |
| 7005732 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate |
February 28, 2006 |
| A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and ad |
| 6924165 |
Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process |
August 2, 2005 |
| A method for providing conductive paths into a hermetically sealed cavity is described. The sealed cavity is formed utilizing a silicon-glass micro-electromechanical structure (MEMS) process and the method includes forming recesses on a glass substrate everywhere that a conductive path i |
| 6888233 |
Systems for buried electrical feedthroughs in a glass-silicon MEMS process |
May 3, 2005 |
| A method for providing conductive paths into a hermetically sealed cavity is described. The sealed cavity is formed utilizing a silicon-glass micro-electromechanical structure (MEMS) process and the method includes forming recesses on a glass substrate everywhere that a conductive path i |
| 6359333 |
Wafer-pair having deposited layer sealed chambers |
March 19, 2002 |
| A wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus |
| 6287940 |
Dual wafer attachment process |
September 11, 2001 |
| Producing the microstructures on separate substrates, which are bonded. One of these structures may be temperature sensitive CMOS electronics. There may be a high-temperature thermal sensor on one wafer and low-temperature CMOS electronics. In the case where the bonding material is polyi |
| 6246305 |
Apparatus and method for operating a micromechanical switch |
June 12, 2001 |
| A micromechanical switch and a method for operating the micromechanical switch between an open position and a closed position by moving a magnet between two positions. The magnet produces a magnetic flux that travels through a magnetically conductive layer. The magnetic flux within the |
| 6040749 |
Apparatus and method for operating a micromechanical switch |
March 21, 2000 |
| A micromechanical switch and a method for operating the micromechanical switch between an open position and a closed position by moving a magnet between two positions. The magnet produces a magnetic flux that travels through one of two different conductive layers. The magnetic flux withi |
| 6036872 |
Method for making a wafer-pair having sealed chambers |
March 14, 2000 |
| A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low |
| 5895233 |
Integrated silicon vacuum micropackage for infrared devices |
April 20, 1999 |
| An efficient method brings together two wafers of dies that contain an infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced |
| 4914742 |
Thin film orthogonal microsensor for air flow and method |
April 3, 1990 |
| A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which |
| 4895616 |
Method for making thin film orthogonal microsensor for air flow |
January 23, 1990 |
| A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which |
| 4891977 |
Microbridge sensor bonding pad design for improved adhesion |
January 9, 1990 |
| An improved connector pad stack structure for use in microstructure devices having a silicon nitride surface in which the sensor metal such as platinum or Ni-Fe is eliminated from the pad bonding site and only adhesion promoting metals are used on the Si.sub.3 N.sub.4 to provide a st |
| 4784721 |
Integrated thin-film diaphragm; backside etch |
November 15, 1988 |
| A microbridge air flow sensor having a silicon nitride diaphragm formed on the surface of a single crystal silicon wafer. A rectangular 500 angstrom thick sacrificial layer was deposited on the silicon surface before the silicon nitride to define the exact position of the diaphragm. A se |
