| Patent Number |
Title Of Patent |
Date Issued |
| 7270762 |
Polishing compositions for noble metals |
September 18, 2007 |
| The polishing composition of this invention is useful for chemical-mechanical polishing of substrates containing noble metals such as platinum and comprises up to about 50% by weight of a adjuvant wherein said adjuvant is s elected from a group consisting of a metal-anion compound, a |
| 6903021 |
Method of polishing a semiconductor device |
June 7, 2005 |
| The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the pol |
| 6899611 |
Polishing pad for a semiconductor device having a dissolvable substance |
May 31, 2005 |
| A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry. |
| 6454633 |
Polishing pads of flocked hollow fibers and methods relating thereto |
September 24, 2002 |
| A polishing pad is provided which is comprised of vertically oriented hollow fibers. Such pads can be produced by electrostatically flocking fibers onto a substrate. |
| 6439989 |
Polymeric polishing pad having continuously regenerated work surface |
August 27, 2002 |
| An article or polishing pad for altering a surface of a workpiece includes a polymeric matrix having a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, the work surface is made relatively softer than the subsurface as |
| 6419556 |
Method of polishing using a polishing pad |
July 16, 2002 |
| A polishing pad for polishing hard surfaces such as glass and silicon wafers and a method of polishing using such a polishing pad. |
| 6337281 |
Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and t |
January 8, 2002 |
| A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like. |
| 6325703 |
Polishing pads and methods relating thereto |
December 4, 2001 |
| A polishing pad having a uniform, continuously interconnected porous surface. The pad is produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering p |
| 6231434 |
Polishing pads and methods relating thereto |
May 15, 2001 |
| A polishing pad having a uniform, continuously interconnected porous surface. The pad is produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering p |
| 6106754 |
Method of making polishing pads |
August 22, 2000 |
| A polishing pad having a substantially uniform, continuously interconnected porous surface. The pad can be produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. |
| 6099954 |
Polishing material and method of polishing a surface |
August 8, 2000 |
| A polishing pad for polishing hard surfaces such as glass and silicon wafers and a method of polishing using such a polishing pad. |
| 6095902 |
Polyether-polyester polyurethane polishing pads and related methods |
August 1, 2000 |
| The present invention provides a polishing pad fabricated from both polyester and polyether polyurethanes. Methods for manufacturing the pads and methods for use of the pads for polishing are also provided. |
| 6069080 |
Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and t |
May 30, 2000 |
| A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like. |
| 6019666 |
Mosaic polishing pads and methods relating thereto |
February 1, 2000 |
| This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece. |
| 6017265 |
Methods for using polishing pads |
January 25, 2000 |
| Polymer-based pads useful for polishing objects, particularly integrated circuits, having interconnected porosity which is uniform in all directions, and where the solid portion of said pad consists of a uniform continuously interconnected polymer material of greater than 50% of the |
| 5900164 |
Method for planarizing a semiconductor device surface with polymeric pad containing hollow polym |
May 4, 1999 |
| The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric micr |
| 5578362 |
Polymeric polishing pad containing hollow polymeric microelements |
November 26, 1996 |
| The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric micr |
