| Patent Number |
Title Of Patent |
Date Issued |
| 6581280 |
Method for filling high aspect ratio via holes in electronic substrates |
June 24, 2003 |
| High aspect ratio (5:1-30:1) and small (5 .mu.m-125 .mu.m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with |
| 6452117 |
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
September 17, 2002 |
| High aspect ratio (5:1-30:1) and small (5 .mu.m-125 .mu.m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with |
| 6387205 |
Dustfree prepreg and method for making an article based thereon |
May 14, 2002 |
| A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaini |
| 6351030 |
Electronic package utilizing protective coating |
February 26, 2002 |
| The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrica |
| 6080684 |
Dustfree prepreg and method for making an article based thereon |
June 27, 2000 |
| A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaini |
| 6071559 |
Dustfree prepreg and method for making an article based thereon |
June 6, 2000 |
| A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaini |
| 5928970 |
Dustfree prepreg and method for making an article based thereon |
July 27, 1999 |
| A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaini |
| 5888850 |
Method for providing a protective coating and electronic package utilizing same |
March 30, 1999 |
| The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrica |
| 5800874 |
Technique for forming resin-impregnated fiberglass sheets |
September 1, 1998 |
| A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices |
| 5783252 |
Technique for forming resin-impregnated fiberglass sheets |
July 21, 1998 |
| A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices |
| 5773371 |
Technique for forming resin-impregnated fiberglass sheets |
June 30, 1998 |
| A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices |
| 5773132 |
Protecting copper dielectric interface from delamination |
June 30, 1998 |
| A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane utilizing a plating solution contain |
| 5756405 |
Technique for forming resin-impregnated fiberglass sheets |
May 26, 1998 |
| A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices |
