| Patent Number |
Title Of Patent |
Date Issued |
| 6268653 |
Semiconductor laser diode multi-chip module |
July 31, 2001 |
| A substrate comprising, for example, a copper-beryllium oxide ceramic-copper sandwich permits a laser diode along with cooperative components to be soldered in place using a high temperature solder. The sandwich structure is operative to move the effective thermal properties of the c |
| 6195376 |
Semiconductor laser array stack package & method of fabrication |
February 27, 2001 |
| Semiconductor laser diodes or diode bars are assembled into stacks by a method which permits testing of an entire stack at once and which uses only high temperature solder. The stack includes a plurality of submounts which resemble elongated bars which are square in cross section. Laser |
| 6178189 |
Multi-layer semiconductor devices with stress-relief profiles |
January 23, 2001 |
| Multi-layer, semiconductor devices are configured to reduce stress by the removal of much of the structure which does not actually contribute to device performance. In one embodiment, trough between mesas which define light emitting facets in a laser diode bar are etched well into the |
| 6086264 |
Fiber-coupled laser device using square cross section fibers and method for fabrication |
July 11, 2000 |
| Square cross section optical fibers are accurately positioned for coupling light from laser diode emitting facets through a fiber lens. The fibers are placed in parallel channels formed in a photolithographic layer on a planar surface of a substrate and constrained in place by a retentio |
| 5550852 |
Laser package with reversed laser diode |
August 27, 1996 |
| A laser package includes a housing and a subassembly to which the critical components of the laser package are mounted. The subassembly is structured to preserve component alignment even in the presence of thermal excursions by ensuring that any movement which might occur effects all the |
| 5537502 |
Laser package with permanently aligned critical components |
July 16, 1996 |
| A laser package includes a housing and a subassembly to which the critical components of the laser package are mounted. The subassembly is structured to preserve component alignment even in the presence of thermal excursions by ensuring that any movement which might occur effects all the |
| 5438580 |
Laser package and method of assembly |
August 1, 1995 |
| A laser package is designed for large scale assembly by machinig a piec3 part of relatively large dimensions where the part has a slot for holding a laser. The piece part is mounted on heatsink of like dimensions. A second piece part includes an elongated groove for holding a fiber lens |
| 5305344 |
Laser diode array |
April 19, 1994 |
| Modified laser submounts are positioned in grooves in the surface of a monolithic substrate permitting not only relatively high packing diversities, but also pretesting and easy replacement of any submounts which may later become defective in the field. The assembly may be connected |
