| Patent Number |
Title Of Patent |
Date Issued |
| 7416370 |
Method and apparatus for transporting a substrate using non-Newtonian fluid |
August 26, 2008 |
| A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian f |
| 7406972 |
Substrate proximity processing structures |
August 5, 2008 |
| An apparatus for generating a fluid meniscus to process a substrate is provided. The apparatus includes a manifold head with a manifold surface having a plurality of conduits configured to generate a fluid meniscus on a substrate surface when positioned proximate the substrate. The manif |
| 7392815 |
Chamber for wafer cleaning and method for making the same |
July 1, 2008 |
| A wafer processing chamber "chamber" is provided. Broadly speaking, the chamber allows a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. More specifically, the chamber utilizes removable plates that can be configured to control the fluid flow and |
| 7389783 |
Proximity meniscus manifold |
June 24, 2008 |
| An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into |
| 7357115 |
Wafer clamping apparatus and method for operating the same |
April 15, 2008 |
| A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom surface of the wafer. The pressure differential serves to pull the wafer toward a wafer suppo |
| 7350315 |
Edge wheel dry manifold |
April 1, 2008 |
| A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum |
| 7293571 |
Substrate proximity processing housing and insert for generating a fluid meniscus |
November 13, 2007 |
| An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receivin |
| 7254900 |
Wafer edge wheel with drying function |
August 14, 2007 |
| An edge wheel for supporting and rotating a disk-shaped substrate includes a wheel body having a peripheral groove configured to support an edge of a substrate and at least one radial channel extending into said wheel body from said peripheral groove. An edge wheel dryer and a method for |
| 7191787 |
Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with |
March 20, 2007 |
| An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer ("wafer") cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination pr |
| 7153388 |
Chamber for high-pressure wafer processing and method for making the same |
December 26, 2006 |
| Broadly speaking, a wafer processing chamber for performing a high pressure wafer process is provided. More specifically, the wafer processing chamber incorporates a wafer processing volume and an outer chamber volume. The wafer processing volume is configured to contain a high press |
| 7089687 |
Wafer edge wheel with drying function |
August 15, 2006 |
| An edge wheel for supporting and rotating a disk-shaped substrate includes a wheel body having a peripheral groove configured to support an edge of a substrate and at least one radial channel extending into said wheel body from said peripheral groove. An edge wheel dryer and a method for |
| 6841006 |
Atmospheric substrate processing apparatus for depositing multiple layers on a substrate |
January 11, 2005 |
| A substrate processing apparatus is disclosed. In one embodiment, the apparatus includes a first atmospheric deposition station and a second atmospheric deposition station. The second atmospheric deposition station comprises an atmospheric pressure vapor deposition chamber. A substrate |
| 6697745 |
Technique and apparatus to control the transient response of a fuel cell system |
February 24, 2004 |
| A technique that is usable with a fuel cell stack includes coupling the fuel cell stack to a load, monitoring a power that is consumed by the load and determining if the power is increasing or decreasing. If the output power is increasing, a first control technique is used to control a f |
| 6581015 |
Technique and apparatus to control the transient response of a fuel cell system |
June 17, 2003 |
| A technique that is usable with a fuel cell stack includes coupling the fuel cell stack to a load and determining a power that is consumed by the load. The technique includes detecting a change in the power that is consumed by the load and controlling a fuel flow to the fuel cell stack t |
| 6504339 |
Technique and apparatus to control the charging of a battery using a fuel cell |
January 7, 2003 |
| A technique that is usable with a fuel cell stack includes providing a fuel flow and using at least some of the fuel flow to produce power with the fuel cell stack. A request is received to charge a battery. In response to the request, the technique includes determining if the remainder |
| 6176198 |
Apparatus and method for depositing low K dielectric materials |
January 23, 2001 |
| The invention provides a deposition system and methods of depositing materials onto substrates. In one aspect, a modular processing chamber is provided which includes a chamber body defining a processing region. The chamber body includes a removable gas feedthrough, an electrical fee |
